Part A: Umbrella Specs - Guideline and Form (ZVEI) 2002-07-24 A 1. Preliminary remarks Statutory provisions and also independent declarations of commitment by the industry have resulted in the current spate of inquiries from customers to their suppliers in respect of the composition of products, and in particular in respect of the type and location of substances and materials. Without standardization, efforts to reduce capital expenditure to a reasonable level on both the customer side and the supplier side will not be successful. A 2. Scope The purpose of this proposal is to standardize responses by suppliers to their customers in respect of the composition of products, and in particular in respect of the type and location of substances and materials. This also includes a form which has been standardized to the maximum possible extent, an explanation of how this form is structured, and instructions on what content should be entered on the form, and how. Product packaging is not dealt with in this paper. A 3. Definitions, abbreviations, references C4E list CAS no. Composition of a single part DKE standardization proposal Mass in % Material group Materials Normative references Product / Package family see... restrictions on substances... within C4E list Abbreviation for Chemical Abstracts Service Registry Number. see DKE standardization proposal Recording substances in products, here: section Definitions, Single part Source: VDE-DKE, Stresemannallee 15, D-60596 Frankfurt/Main, Germany, version: 2002-02-12 specifies the composition part (ingredient) etc. in terms of percentage by weight relative to the whole component. see DKE standardization proposal Recording substances in products, here: Annex Substance list, column Substance group. see DKE standardization proposal Recording substances in products, here: section Definitions, Substances. see DKE standardization proposal Recording substances in products, here: section Normative references, excluding C4E list. Structural similar group of products or packages with the same typical composition (within a certain range) of (constituent) substances. Explanation: Electronic components, e.g. semiconductor components and passive components, have the most spreading functions and application areas. Nonetheless, these components can be grouped into families. These families are then similar in terms of the type of their constituent substances and materials, and in their composition within a certain range. Page 1 of 15
Part A: Umbrella Specs - Guideline and Form (ZVEI) 2002-07-24 Product... restrictions on substances... within C4E list Sum Traces Umbrella specification (abbreviated: Uspec) Weight range see DKE standardization proposal Recording substances in products, here: section Definitions, Product. http://www.eicta.org/content/default.asp?pageid=211 C4E is the abbreviation for CEFIC EECA EICTA. specifies the percentage per composition part are substances with an average mass percentage less than 0.1 wt-%; where more tight statutory regulations exist defining upper limits, traces are the values that fall below this limit. Denotes a completed form that conforms to the standard as explained above and takes account of the instructions on filling out the standardized form. Note: Assurances concerning the characteristics of a product can only be given by the respective manufacturer. Specifies the greatest and smallest weight in a package family. A 4. Requirements relating to recording of substances and materials in the Uspec The preferred language for entries is English. Established terms in English are not translated. Chemical substance symbols and terms may be used. CAS no is mandatory if available. The information given on substances and materials refers to a specific package or specific package family. The specified percentages of substances and materials in products must add up to 100%. Traces are not included in this and potential hazardous substances are indicated in a separate column, e.g. by x or. Only the materials actually present in the product are recorded. Materials from production processes, even if there are residues of these in the product are not taken into account: Particularly residual monomers in polymers. The materials are specified using a unique and unambiguous nomenclature (see DKE standardization proposal Recording substances in products ). Substance and substance group names are based on the DKE standardization proposal Recording substances in products.... restrictions on substances... are based on the C4E list: http://www.eicta.org/content/default.asp?pageid=211 Page 2 of 15
Part A: Umbrella Specs - Guideline and Form (ZVEI) 2002-07-24 A 5. Layout of the form Product Content Sheet A B C D E F G 1 Company logo, optional 2 Product Content Sheet 3 Package family Picture of typical product, optional 4 Date 5 Version 6 7a Composition part Material group Materials CAS if applicable Average mass [weight-%] *) Sum [%] Traces 7b... Sum in total: or: 8a Weight range 8b Tolerance Dimensions**) and weight range *) related to package weight; weight in particular, see corresponding package weight list **) optional 9 Not part of package family Company Address Important remarks: 1) Traces are product parts, substances etc. that are below a percentage of 0.1 % by weight., if not otherwise regulated (see note no. 2). 2) A list of the (legal)... restrictions on substances... or materials is available at internet address: http://www.eicta.org/content/default.asp?pageid=211 3) Substances, materials etc. with possible harmful effects on human beings and the environment are listed. 4) There are no risks for human beings and to the environment if products are properly used as designated. This shall not apply to risks caused during procedures for disposal etc. 5) All statements herein are based on our present knowledge. If our products are used properly, there are no risks to human beings and/or the environment. Page 3 of 15
Part A: Umbrella Specs - Guideline and Form (ZVEI) 2002-07-24 A 6. Layout of the form, Package Weight List A B Company logo, optional Package Weight List (Single weights of Products, materials data see Product Content Sheet on previous page) 10 Package family 11 Date 12 Version Uspec short*) Package family*) Package Internal package code Pin count Weight [grams] Remark... *) USpec short name and Package family are optional, e.g. for summary of several package weight lists Company Address Page 4 of 15
Part A: Umbrella Specs - Guideline and Form (ZVEI) 2002-07-24 A 7. Instructions on filling out the forms Product Content Sheet and Package Weight List General B3 B5 A7a -... B7a -... C7a -... D7a - Column/row designations: These are listed in section 5 above. They should be deleted when producing an USpec. Cell - Package family: A typical entry for semiconductor components would be e.g. P-DIP. It is recommended to describe this package family in detail in a commonly understandable way. Cell - Version: see section 4. Column supplier-/industry-specific list of composition part: The number of rows is determined by how many construction elements are (must be) specified. Column Material group: The relevant designations from the DKE standardization proposal Recording substances in products, Annex Substance list, column Substance group, are entered here in capital letters. Column Materials: see section 4; with alloys, solders etc. it is useful to specify the composition in addition. Column CAS: CAS nos. are entered here only if the relevant number actually exists. Please enter - if CAS no. doesn t exist. E7a -... F7a -... G7a -... Please note: It makes no sense to break down, mixtures etc. into their constituent elements and then specify the CAS no. for these. Column Average mass: The entries here relate to the previous column and the specified materials. Percentage values should be specified to one decimal place only. Column Sum: This number is the sum of the percentage values given in the previous column Average mass and indicates the percentage of the respective composition part in the component or in the package family. Column Traces: The relevant rows are marked in this column, e.g. with x or, to indicate traces that are known to the supplier, e.g. from the safety data sheet for the source material, and that have been intentionally introduced into the product and may represent significant risks to human beings and the environment if not properly used, e.g. substances that then have a toxic, very toxic, carcinogenic, mutagenic or reprotoxic effect. A8a/A8b Weight range/tolerance Dimensions and weight range: Either entry A8a or entry A8b should be included in the USpec. If A8a is included, the tolerance should be entered as a percentage, e.g. ± 10 %. This means that the percentage fluctuates in this range, e.g. 28.7 % ± 2.9 %. B8a/B8b Weight range/... -.../ Weight range: Values specified in the usual notation, e.g. [g] for weight in grams B10 B12 see B3 see B5 A 8. Concluding remarks Only manufacturers or suppliers can confirm compliance of their products with specifications like this umbrella spec. Page 5 of 15
Examples of completed Umbrella Specifications and Package Weight Lists The details specified in the examples have been chosen arbitrarily. They are not subject to a change service. Liability claims are therefore excluded. The corresponding package weight lists covers just one Umbrella Specification. Content: Active components: Philips Active components: Texas Instruments Active components: Motorola Active components: Infineon Technologies Passive components: Epcos Umbrella Spec P-DIP (Plastic Dual In line Package) Umbrella Spec SOIC (Small Outline Integrated Circuit) Umbrella Spec PLCC (Plastic Leadless Chip Carrier) Umbrella Spec P-TO263 (D-Square-Pak) Umbrella Spec Inductive component, ferrite, E,I,U,R cores, open frame Page 6 of 15
Product Content Sheet Package family P-DIP (Plastic Dual In line Package) Date 2002-05-22 Version 2 Composition part Material group Materials Chip CAS if applicable Average mass [weight -%] *) Silicon - 0.4 0.4 Wires Noble metal Gold 7440-57-5 0.1 0.1 Leadframe Copper alloy Copper - 24.5 25 Iron - 0.5 Diepad plating Noble metal Silver 7440-22-4 0.1 0.1 Encapsulation Polymer EP - 19 73.6 Polymer Brominated EP **) - 0.4 Antimony and inorganic Silicon dioxide - 51.2 Diantimony trioxide **) 1309-64-4 3 Leadfinish Nonferrous metal Tin 7440-32-6 0.8 0.8 Weight range 0.5... 7.7grams *) Fluctuation margin +/- 25 % *) related to package weight; weight in particular, see corresponding package weight list for package family P-DIP **) utilized as flame retardant Company Philips Important remarks: Sum in total: 100 Sum [%] Traces 1) Traces are product parts, substances etc. that are below a percentage of 0.1 % by weight. Higher limits are accepted if the substance or material is (legally) regulated (see note no. 2). 2) A list of the (legal)... restrictions on substances... or materials or materials is available at internet address: http://www.eicta.org/content/default.asp?pageid=113. 3) Substances, materials etc. with possible harmful effects on human beings and the environment are listed. 4) There are no risks for human beings and to the environment if products are properly used as designated. This shall not apply to risks caused during procedures for disposal etc. 5) All statements herein are based on our present knowledge. If our products are used properly, there are no risks to human beings and/or the environment. Page 7 of 15
Package Weight List Package family Date 2002-05-22 Version 2 Pin count Weight [grams] P-DIP (Plastic Dual In line Package) Internal package code Philips 8 0.5 SOT97 14 1.0 SOT27 16 1.2 SOT38 18 1.2 SOT102 20 1.3 SOT146 24 3.8 SOT101 24 1.7 SOT222 28 4.3 SOT117 40 6.2 SOT129 48 7.7 SOT240 Company Philips Page 8 of 15
Product Content Sheet Package family SOIC (Small Outline Integrated Circuit) Date 2002-05-22 Version 2 Composition part Material group Materials Chip (die) CAS if applicable Average mass [weight -%] *) Silicon - 2.0 2.0 Wires Noble metal Gold 7440-57-5 0.19 0.19 Leadframe Copper alloy Copper - 36 36.8 Iron _ 0.8 Die attach Noble metal Silver - 0.25 0.32 Sum [%] Traces Polymer EP - 0.07 Encapsulation Polymer EP - 13.8 59.3 Polymer Brominated EP**) - 2.2 Antimony and inorganic Silicon dioxide - 42 Diantimony trioxide**) 1309-64-4 0.3 Leadfinish Nickel alloy Nickel - 1.4 1.4 Weight range Fluctuation margin +/- 25 % 0.080 0.693 grams *) Gold - x Palladium - x *) related to package weight; weight in particular, see corresponding package weight list for package family P-PDSO-G **) utilized as flame retardant Company Texas Instruments Important remarks: Sum in total: 100 1) Traces are product parts, substances etc. that are below a percentage of 0.1 % by weight. Higher limits are accepted if the substance or material is legally regulated (see note no. 2). 2) A list of the (legal)... restrictions on substances... or materials or materials is available at internet address: http://www.eicta.org/content/default.asp?pageid=113. 3) Substances, materials etc. with possible harmful effects on human beings and the environment are listed. 4) There are no risks for human beings and to the environment if products are properly used as designated. This shall not apply to risks caused during procedures for disposal etc. 5) All statements herein are based on our present knowledge. If our products are used properly, there are no risks to human beings and/or the environment. Page 9 of 15
Package Weight List Package family Date 2002-05-22 Version 2 Pin count Weight [grams] SOIC (Small Outline Integrated Circuit) Internal package code TI*) 8 0.080 D 14 0.127 D 16 0.150 D 16 0.403 DW 20 0.503 DW 24 0.599 DW 28 0.693 DW *) D = narrow body, DW = wide body Company Texas Instruments Page 10 of 15
Product Content Sheet Package family Date 2002-05-27 Version 1.0 PLCC (Plastic Leadless Chip Carrier) Composition part Material group Materials Chip (die) CAS if applicable Average mass [weight -%] *) Silicon - 0.721 0.721 Sum [%] Traces Wires Noble metal Gold 7440-57-5 0.079 0.079 Leadframe Copper alloy Copper - 23.914 24.608 Iron _ 0.65 Zinc _ 0.044 Die attach Noble metal Silver - 0.024 0.026 Polymer EP - 0.046 0.046 Encapsulation Polymer EP - 16.313 73.131 Polymer Brominated EP**) - 1.466 Antimony and inorganic Silicon dioxide - 52.96 Diantimony trioxide**) 1309-64-4 2.191 Leadfinish Tin alloy Tin - 0.915 Weight range 0.67 6.74 grams *) Fluctuation margin +/- 25 % Lead - 0.275 *) related to package weight; weight in particular, see corresponding package weight list for package family PLCC **) utilized as flame retardant Company Motorola Important remarks: Sum in total: 100 1) Traces are product parts, substances etc. that are below a percentage of 0.1 % by weight. Higher limits are accepted if the substance or material is legally regulated (see note no. 2). 2) A list of the (legal)... restrictions on substances... or materials or materials is available at internet address: http://www.eicta.org/content/default.asp?pageid=113. 3) Substances, materials etc. with possible harmful effects on human beings and the environment are listed. 4) There are no risks for human beings and to the environment if products are properly used as designated. This shall not apply to risks caused during procedures for disposal etc. 5) All statements herein are based on our present knowledge. If our products are used properly, there are no risks to human beings and/or the environment. Page 11 of 15
Package Weight List Package family Date 2002-05-27 Version 1.0 Pin count Weight [grams] PLCC (Plastic Leadless Chip Carrier) Internal package code Motorola 20 0.670 0802 28 1.080 0804 44 2.237 0801 52 3.883 0805 68 4.583 0803 84 6.743 0806 Company Motorola Page 12 of 15
Product Content Sheet Package family Date 2002-05-22 Version 2 P-TO263 (D-Square-Pak) Composition part Material group Materials Chip CAS if applicable Average mass [weight -%] *) Silicon 7440-21-3 0.4 0.4 Wires Nonferrous metal Aluminium 7429-90-5 0.1 0.1 Leadframe Copper alloy Copper - 58.0 58.1 Iron - 0.1 Sum [%] Traces Diepad plating Other metal Nickel 7440-02-0 x Encapsulation Polymer EP - 6.7 Polymer Brominated EP - 0.8 Antimony and inorganic Silicon dioxide **) 60676-86- 0 Diantimony trioxide **) 1309-64-4 0.8 31.3 39.6 Die attach Tin alloy Tin - 0.2 0.3 Silver - 0.1 Antimony - x Leadfinish Tin alloy Tin - 1.2 1.5 Weight range 1.0... 1.6 grams *) Fluctuation margin +/- 25 % Lead - 0.3 *) related to package weight; weight in particular, see corresponding package weight list for package family P-TO263 **) utilized as flame retardant Not part of package family P-TO263-15 Company Infineon Technologies Important remarks: Sum in total: 100 1) Traces are product parts, substances etc. that are below a percentage of 0.1 % by weight. Higher limits are accepted if the substance or material is legally regulated (see note no. 2). 2) A list of the (legal)... restrictions on substances... or materials or materials is available at internet address: http://www.eicta.org/content/default.asp?pageid=113. 3) Substances, materials etc. with possible harmful effects on human beings and the environment are listed. 4) There are no risks for human beings and to the environment if products are properly used as designated. This shall not apply to risks caused during procedures for disposal etc. 5) All statements herein are based on our present knowledge. If our products are used properly, there are no risks to human beings and/or the environment. Page 13 of 15
Package Weight List Package family Date 2002-05-22 Version 2 Pin count Weight [grams] P-TO263 (D-Square-Pak) Internal package code 3 1.4 3-1 3 1.0 3-11 3 1.5 3-12 3 1.5 3-2 5 1.5 5-1 5 1.5 5-2 7 1.6 7-1 7 1.6 7-2 Company Infineon Technologies Page 14 of 15
Product Content Sheet Package family Date 2001-10-05 Version 1 Inductive component, ferrit, E,I,U,R cores, open frame Composition part Material group Materials Active part Ceramic cont. Iron trioxide, manganese oxide nickel oxide, zinc oxide *) CAS if applicable Average mass [weight -%] *) Fe203 70 MnO2 NiO ZnO Isolating and fixing Polymer Thermoplastics, Adhesitives Conductors Nonferrous metals Cu, Pb, Sn 23 Iron *) Ceramic, magnetic mainly consists of Fe2O3, ZnO, MnO, NiO with the addition of further elements in multiple states. The following elements may be present in traces up to low percentages: Cobalt, barium, copper, silicon, vanadium, aluminum, calcium,.... Normally the details of composition are manufacturers property and treated as confidential Typical products Fe Sum [%] Traces 7 Sum in total: 100 Case size Length (mm) Width (mm) Height (mm) Mass (grams) EF 12,6/3,7 14.5 11.5 15.5 3.9 EF16/4,7 19.5 17.5 13.5 6.9 RK17a 24 14 13.5 9.3 EVD25 26.5 26.5 21 30.9 EVD30 40 31 20 49.2 E42/20 54.5 42.5 52.5 188 Company/Companies Epcos Vogt Important remarks: 1) Traces are product parts, substances etc. that are below a percentage of 0.1 % by weight. Higher limits are accepted if the substance or material is legally regulated (see note no. 2). 2) A list of the (legal)... restrictions on substances... or materials or materials is available at internet address: http://www.eicta.org/content/default.asp?pageid=113. 3) Substances, materials etc. with possible harmful effects on human beings and the environment are listed. 4) There are no risks for human beings and to the environment if products are properly used as designated. This shall not apply to risks caused during procedures for disposal etc. 5) All statements herein are based on our present knowledge. If our products are used properly, there are no risks to human beings and/or the environment. Page 15 of 15