Qualification and Performance Specification for Rigid Printed Boards Developed by the Rigid Printed Board Performance Specifications Task Group (D-33a) of the Rigid Printed Board Committee (D-30) of IPC Supersedes: IPC-6012C - April 2010 IPC-6012B with Amendment 1 - July 2007 IPC-6012B - August 2004 IPC-6012A with Amendment 1 - July 2000 IPC-6012A - October 1999 IPC-6012 - July 1996 IPC-RB-276 - March 1992 Users of this publication are encouraged to participate in the development of future revisions. Contact: IPC 3000 Lakeside Drive, Suite 105N Bannockburn, Illinois 60015-1249 Tel 847 615.7100 Fax 847 615.7105
Table of Contents 1 SCOPE... 1 1.1 Statement of Scope... 1 1.2 Purpose... 1 1.2.1 Supporting Documentation... 1 1.3 Performance Classification and Type... 1 1.3.1 Classification... 1 1.3.2 Printed Board Type... 1 1.3.3 Selection for Procurement... 1 1.3.4 Material, Plating Process and Final Finish... 3 1.4 Terms and Definitions... 4 1.4.1 High Density Interconnects (HDI)... 4 1.4.2 Microvia... 4 1.5 Interpretation... 4 1.6 Presentation... 4 1.7 Revision Level Changes... 4 2 APPLICABLE DOCUMENTS... 5 2.1 IPC... 5 2.2 Joint Industry Standards... 6 2.3 Federal... 7 2.4 Other Publications... 7 2.4.1 American Society for Testing and Materials... 7 2.4.2 Underwriters Lab... 7 2.4.3 National Electrical Manufacturers Association... 7 2.4.4 American Society for Quality... 7 2.4.5 AMS... 7 2.4.6 American Society of Mechanical Engineers... 7 3 REQUIREMENTS... 8 3.1 General... 8 3.2 Materials... 8 3.2.1 Laminates and Bonding Material... 8 3.2.2 External Bonding Materials... 8 3.2.3 Other Dielectric Materials... 8 3.2.4 Metal Foils... 8 3.2.5 Metal Planes/Cores... 8 3.2.6 Base Metallic Plating Depositions and Conductive Coatings... 8 3.2.7 Final Finish Depositions and Coatings Metallic and Non-Metallic... 9 3.2.8 Polymer Coating (Solder Mask)... 10 3.2.9 Fusing Fluids and Fluxes... 10 3.2.10 Marking Inks... 10 3.2.11 Hole Fill Insulation Material... 12 3.2.12 Heatsink Planes, External... 12 3.2.13 Via Protection... 12 3.2.14 Embedded Passive Materials... 12 3.3 Visual Examination... 12 3.3.1 Edges... 13 3.3.2 Laminate Imperfections... 13 3.3.3 Plating and Coating Voids in the Hole... 14 3.3.4 Lifted Lands... 14 3.3.5 Marking... 14 3.3.6 Solderability... 15 3.3.7 Plating Adhesion... 15 3.3.8 Edge Printed Board Contact, Junction of Gold Plate to Solder Finish... 15 3.3.9 Workmanship... 15 3.4 Printed Board Dimensional Requirements... 15 3.4.1 Hole Size, Hole Pattern Accuracy and Pattern Feature Accuracy... 16 3.4.2 Annular Ring and Breakout (External)... 16 3.4.3 Bow and Twist... 18 3.5 Conductor Definition... 18 3.5.1 Conductor Width and Thickness... 18 3.5.2 Conductor Spacing... 18 3.5.3 Conductor Imperfections... 18 3.5.4 Conductive Surfaces... 19 3.6 Structural Integrity... 21 3.6.1 Thermal Stress Testing... 21 3.6.2 Requirements for Microsectioned Coupons or Printed Boards... 22 3.7 Solder Mask Requirements... 34 3.7.1 Solder Mask Coverage... 34 3.7.2 Solder Mask Cure and Adhesion... 35 3.7.3 Solder Mask Thickness... 35 3.8 Electrical Requirements... 35 3.8.1 Dielectric Withstanding Voltage... 35 3.8.2 Electrical Continuity and Isolation Resistance... 35 3.8.3 Circuit/PTH Shorts to Metal Substrate... 35 3.8.4 Moisture and Insulation Resistance (MIR)... 35 3.9 Cleanliness... 36 3.9.1 Cleanliness Prior to Solder Mask Application... 36 3.9.2 Cleanliness After Solder Mask, Solder, or Alternative Surface Coating Application... 36 3.9.3 Cleanliness of Inner Layers After Oxide Treatment Prior to Lamination... 36 v
September 2015 3.10 Special Requirements... 36 3.10.1 Outgassing... 36 3.10.2 Fungus Resistance... 36 3.10.3 Vibration... 36 3.10.4 Mechanical Shock... 36 3.10.5 Impedance Testing... 37 3.10.6 Coefficient of Thermal Expansion (CTE)... 37 3.10.7 Thermal Shock... 37 3.10.8 Surface Insulation Resistance (As Received)... 37 3.10.9 Metal Core (Horizontal Microsection)... 37 3.10.10 Rework Simulation... 37 3.10.11 Bond Strength, Unsupported Component Hole Land... 37 3.10.12 Destructive Physical Analysis... 37 3.10.13 Peel Strength Requirements (For Foil Laminated Construction Only)... 37 3.11 Repair... 38 3.11.1 Circuit Repairs... 38 3.12 Rework... 38 4 QUALITY ASSURANCE PROVISIONS... 38 4.1 General... 38 4.1.1 Qualification... 38 4.1.2 Sample Test Coupons... 38 4.2 Acceptance Tests... 38 4.2.1 C=0 Zero Acceptance Number Sampling Plan... 38 4.2.2 Referee Tests... 39 4.3 Quality Conformance Testing... 39 4.3.1 Coupon Selection... 39 5 NOTES... 44 5.1 Ordering Data... 44 5.2 Superseded Specifications... 44 APPENDIX A... 45 Figures Figure 1-1 Microvia Definition... 4 Figure 3-1 Annular Ring Measurement (External)... 17 Figure 3-2 Breakout of 90 and 180... 18 Figure 3-3 External Conductor Width Reduction... 18 Figure 3-4 Example of Intermediate Target Land in a Microvia... 18 Figure 3-5 Rectangular Surface Mount Lands... 19 Figure 3-6 Round Surface Mount Lands... 19 Figure 3-7 Printed Board Edge Connector Lands... 20 Figure 3-8 Plated Hole Microsection (Grinding/ Polishing) Tolerance... 22 Figure 3-9 An Example of Plating to Target Land Separation... 22 Figure 3-10 Crack Definition... 24 Figure 3-11 Separations at External Foil... 24 Figure 3-12 Plating Folds/Inclusions Minimum Measurement Points... 24 Figure 3-13 Microsection Evaluation Laminate Attributes... 25 Figure 3-14 Measurement for Etchback... 25 Figure 3-15 Measurement for Dielectric Removal... 26 Figure 3-16 Measurement for Negative Etchback... 26 Figure 3-17 Annular Ring Measurement (Internal)... 27 Figure 3-18 Microsection Rotations for Breakout Detection... 27 Figure 3-19 Comparison of Microsection Rotations... 27 Figure 3-20 Example of Non-Conforming Dielectric Spacing Reduction Due to Breakout at Microvia Target Land... 28 Figure 3-21 Surface Copper Wrap Measurement for Filled Holes... 28 Figure 3-22 Surface Copper Wrap Measurement for Non-Filled Holes... 28 Figure 3-23 Wrap Copper in Type 4 Printed Board (Acceptable)... 29 Figure 3-24 Wrap Copper Removed by Excessive Sanding/Planarization/Etching (Not Acceptable)... 29 Figure 3-25 Copper Cap Thickness... 30 Figure 3-26 Copper Cap Filled Via Height (Bump)... 30 Figure 3-27 Copper Cap Depression (Dimple)... 30 Figure 3-28 Copper Cap Plating Voids... 30 Figure 3-29 Example of Acceptable Voiding in a Cap Plated, Copper Filled Microvia... 31 Figure 3-30 Example of Acceptable Voiding in a Copper Filled Microvia without Cap Plating... 31 Figure 3-31 Example of Nonconforming Void in a Cap Plated, Copper Filled Microvia... 31 Figure 3-32 Example of Nonconforming Void in a Copper Filled Microvia... 31 Figure 3-33 Microvia Contact Dimension... 31 Figure 3-34 Exclusion of Separations in Microvia Target Land Contact Dimension... 32 Figure 3-35 Penetration of Microvia Target Land... 32 Figure 3-36 Metal Core to PTH Spacing... 33 Figure 3-37 Measurement of Minimum Dielectric Spacing... 33 Figure 3-38 Fill Material in Blind/Through Vias When Cap Plating Not Specified... 34 vi
Tables Table 1-1 Technology Adders... 2 Table 1-2 Default Requirements... 3 Table 3-1 Metal Planes/Cores... 8 Table 3-2 Maximum Limits of SnPb Solder Bath Contaminant... 9 Table 3-3 Final Finish and Coating Requirements... 11 Table 3-4 Surface and Hole Copper Plating Minimum Requirements for Buried Vias > 2 Layers, Through-Holes, and Blind Vias... 12 Table 3-5 Surface and Hole Copper Plating Minimum Requirements for Microvias (Blind and Buried)... 12 Table 3-6 Surface and Hole Copper Plating Minimum Requirements for Buried Cores (2 layers)... 12 Table 3-7 Plating and Coating Voids in the Hole... 14 Table 3-8 Edge Printed Board Contact Gap... 15 Table 3-9 Minimum Annular Ring... 17 Table 3-10 Plated Hole Integrity After Stress... 23 Table 3-11 Cap Plating Requirements for Filled Holes... 30 Table 3-12 Microvia Contact Dimension... 31 Table 3-13 Internal Layer Foil Thickness after Processing... 32 Table 3-14 External Conductor Thickness after Plating... 33 Table 3-15 Solder Mask Adhesion... 35 Table 3-16 Dielectric Withstanding Voltages... 35 Table 3-17 Insulation Resistance... 36 Table 4-1 Qualification Test Coupons... 39 Table 4-2 C=0 Sampling Plan per Lot Size... 40 Table 4-3 Acceptance Testing and Frequency... 40 Table 4-4 Quality Conformance Testing... 44 vii
Qualification and Performance Specification for Rigid Printed Boards 1 SCOPE 1.1 Statement of Scope This specification establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards. 1.2 Purpose The purpose of this specification is to provide requirements for qualification and performance of rigid printed boards based on the following constructions and/or technologies. These requirements apply to the finished product unless otherwise specified: Single-sided, double-sided printed boards with or without plated-through holes (PTHs). Multilayer printed boards with PTHs with or without buried/blind vias/microvias. Active/passive embedded circuitry printed boards with distributive capacitive planes and/or capacitive or resistive components. Metal core printed boards with or without an external metal heat frame, which may be active or non-active. 1.2.1 Supporting Documentation IPC-A-600, which contains figures, illustrations and photographs that can aid in the visualization of externally and internally observable acceptable/nonconforming conditions, may be used in conjunction with this specification for a more complete understanding of the recommendations and requirements. 1.3 Performance Classification and Type 1.3.1 Classification This specification establishes acceptance criteria for the performance classification of rigid printed boards based on customer and/or end-use requirements. Printed boards are classified by one of three general Performance Classes as defined in IPC-6011. 1.3.1.1 Requirement Deviations Requirements deviating from these heritage classifications shall be as agreed between user and supplier (AABUS). 1.3.1.2 Space Requirement Deviations Space performance classification deviations are provided in the S Addendum and are applicable when the addendum is specified within the procurement documentation. 1.3.2 Printed Board Type Printed boards without PTHs (Type 1) and with PTHs (Types 2-6) are classified as follows and may include technology adders as described in Table 1-1: Type1 Single-Sided Printed Board Type2 Double-Sided Printed Board Type3 Multilayer Printed Board without blind or buried vias Type4 Multilayer Printed Board with blind and/or buried vias (may include microvias) Type5 Multilayer metal core Printed Board without blind or buried vias Type6 Multilayer metal core Printed Board with blind and/or buried vias (may include microvias) 1.3.3 Selection for Procurement Performance class shall be specified in the procurement documentation. The procurement documentation shall provide sufficient information to fabricate the printed board and ensure that the user receives the desired product. Information that should be included in the procurement documentation is to be in accordance with IPC-2611 and IPC-2614. The procurement documentation shall specify the thermal stress test method to be used to meet the requirement of 3.6.1. Selection shall be from those depicted in 3.6.1.1, 3.6.1.2 and 3.6.1.3. If not specified (see 5.1), the default shall be per Table 1-2. 1