Analysis of EWS Test Data for Reliability Improvement through Outlier Detection and Automated Ink Map Generation

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Analysis of EWS Test Data for Reliability Improvement through Outlier Detection and Automated Ink Map Generation Michael Scott Test Advantage Inc. June 8, 2005

Toward ZERO DEFECTS There is an established relationship between Burn-In failures/elfs and abnormal devices in the Bin population Quality is inversely proportional to variance Eliminating classified outlier devices from the Bin population will reduce the number of early life failures DPPM DPPB 2

Overview Outlier Detection Technology Confirmed Parametric and Spatial Outliers Automatic Ink Map Update Recipe driven merge Yield Impact Analysis In-Line Automated System Functional building blocks Summary 3

Outlier Detection Coverage PAT (AEC Q00 Rev C) Addresses: Gaussian Data Distributions Comprehensive Outlier Detection Addresses: Any Type of Data Distributions Wafer to Wafer Population Shifts Test Limit Dependencies (Existence, Location, Cp, Cpk) Asymmetric thresholds for control limits Classification of detected outliers In Addition to Parametric Outlier Detection: Advanced Spatial Outlier Detection Methodologies 4

Parametric Outlier Test failures gross outlier removal Parametric Outliers atypical results in Bin population 5

Data Population Distributions Dynamic determination of data distribution per wafer/per test based upon skewness, kurtosis and other estimation techniques Automatic selection of qualified detection algorithm or algorithms for the respective distribution analysis Differentiate between Population and Test Limit Outliers, use asymmetric scaling factors Normal LTL LTL LCL UCL UTL Normal Distribution Pass Bin LCL UCL UTL Log-Normal Distribution Pass Bin LTL LCL UCL UTL 6 Specification Fail Bin Classification Fail Bin Classification Fail Bin Specification Fail Bin Specification Fail Bin Classification Fail Bin Classification Fail Bin Specification Fail Bin Specification Fail Bin Classification Fail Bin Classification Fail Bin Specification Fail Bin Clamped Distribution Pass Bin LCL UCL UTL Specification Fail Bin Classification Fail Bin Classification Fail Bin Specification Fail Bin LTL Bi-Modal Distribution Pass Bin

Dynamic Outlier Algorithm Selection Algorithms applied to test/data populations Normal Quasi- Log- Non (Gaussian) Normal Categorical Normal No or invalid test limits Median Sigma and IQR Distribution only IQR Distribution only Median Sigma Distribution only IQR Distribution only No or invalid LTL Median Sigma and IQR Distribution and Test positive IQR Distribution and Test positive Median Sigma Distribution and Test positive IQR Distribution and Test positive No or invalid UTL Median Sigma and IQR Distribution and Test negative IQR Distribution and Test negative Median Sigma Distribution and Test negative IQR Distribution and Test negative Valid test limits Median Sigma IQR Median Sigma IQR and IQR Distribution and Test Distribution and Test Distribution and Test Distribution and Test 7

Automatic Outlier Detection Operation On The Fly Outlier Detection Algorithm Selection defined by Data Population Distribution and Test Limits TEST Criteria Method Method 2 Method 3 Method 4 Method 5 Method 6 OUTLIER_COUNT T_400 Rule 3 - - USED USED USED USED T_32 Rule - - - - USED USED T_3 Rule - - - - USED USED T_6 Rule 3 - - USED USED USED USED 0 T_5 Rule 7 - USED - - USED - 2 T_00 Rule 5 USED - USED - - - 2 T_55 Rule - - - - USED USED 2 T_54 Rule - - - - USED USED T_509 Rule 3 - - USED USED USED USED 0 T_508 Rule 3 - - USED USED USED USED T_7 Rule 8 - - USED USED - - T_6 Rule 3 - - USED USED USED USED 3 T_5 Rule 3 - - - - - - 0 8

Parametric Outlier Classifications Distribution Outliers vs. Test Outliers Conventional techniques are distribution centric Test limits provide additional insight that can improve outlier classification Asymmetric thresholds for parametric outlier analysis Outlier Magnitudes Large, Medium, Small, Tiny Outlier Device Classification Multiple parametric anomalies for the same device 9

Parametric Outlier Classifications = Test Limit Failure / Outlier = Bin Outlier 0

Outlier Classification Merge Recipe Managed Rules Outlier Weighting Magnitude and Frequency Specific Tests may be considered uniquely Example Classification Rules: CRITICAL= L > 0 or M > 4 MARGINAL= M 2 or S > 0 Device Test Test 2 Test 3 # T # S # M # L 0, T M L 0 0,2 M - M 0 0 2 0 Results: Device 0, is classified as CRITICAL = Bin 20 Device 0,2 is classified as MARGINAL = Bin 0

Spatial Outlier Detection Recipe-driven downgrading of devices based on proximity to Failing and Outlier Devices Measurably Reduce Full-Wafer Scrap and ensure reliability of Bin die Configurable and flexible methods controlled via user-defined recipes User-defined sensitivity and proximity techniques driven by process, product, and quality policy 2

Geographic Analysis Application Proximity weighting with smoothing Guardbanding with smoothing Parametric Outlier Devices comprehended in Spatial Analysis Good Die in a Bad Neighborhood 3

Stepper and/or Repeating Pattern Detected Pattern Completed Pattern 4

Wafer Data Merge Process Recipe Managed Rules Parametric outlier classification results and spatial analysis map(s) Merge all datasets together based on user defined merge priority X, Y 0 2 3 4 Hardware Bins 4 Parametric Bins 20 30 Spatial Bins 45 Merge Results 20 45 4 5

Wafer Merge Results Tester Bin Results Final Merged Results 6

What is the Impact to Yield? Yield Impact 94.00% 92.00% Lot Yield 90.00% 88.00% 86.00% Orig. Yield New Yield 84.00% 82.00% 2 3 4 5 Lot # Lot Parts Fails Critical Proximity Orig Yield(% ) New Yield(% ) Delta(% ) 23064 3249 26 6 85.9 85.73 0.8 2 2203 2784 42 5 87.40 87.9 0.2 3 9220 94 5 6 90.04 89.93 0. 4 23064 627 24 0 92.95 92.84 0.0 5 23064 73 23 0 92.49 92.40 0.07 055 305 30 27 89.77 89.63 0.4 7

Functional Building Blocks User-defined Recipe EWS Data Parametric Outlier Analysis + Spatial Outlier Analysis Updated Ink Map Automated Analysis Objectives: In-Line Automated 00% of the Data is Analyzed 8

Menu Driven Recipe Management Approach 9

Toward Zero Defect Production Identification and rules-based classification of Parametric Outliers in any type of test data distribution Rules-based Spatial Outlier detection Maximum outlier detection coverage Rules-based classification and merge identifying Qualified Device Outliers Managed Yield vs. DPPM 00% data analysis by a fully integrated and automated in-line production system 20