Materials Declaration Form

Transcription

1 Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics Response Date * Company Unique ID NL B01 Request Document ID Contact Name * Refer to Supplier Comment section Contact Phone * Refer to Supplier Comment section Contact * Authorized Representative * Giovanni Giacopello Representative Title Representative Phone * Refer to Supplier Comment section Representative * Supplier Comment Online Technical Support - STMicroelectronics : NA Refer to Supplier Comment section Refer to Supplier Comment section ADG MD CHAMPION Refer to Supplier Comment section Uncertainty Statement While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents. Legal Statement Supplier Acceptance * true Legal Declaration * Standard Legal Statement Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as omprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier s liability and the Company s remedies for issues that arise regarding information the Supplier provides in this form.

2 Product Mfr Item Number Mfr Item Name Version Mfr Site Date Z0103MUF ZHBJ*Z1G016R A BO2A Manufacturing information, Comment Amount UoM Unit type ST ECOPACK Grade mg Each ECOPACK 2 J-STD-020 MSL Rating Classification Temp Nbr of Reflow Cycles bulk Solder Termination Terminal Plating Terminal Base Alloy Comment Not Applicable Tin (Sn), matte, annealed Copper Alloy ECOPACK 2 is STMicroelectronics trade name for ROHS compliant device without Brominated and Chlorinated compound (900ppm) and without Antimony oxide flame retardant ( in each organic material) Package Designator Size Nbr of instances Shape CHP flat Comment Package: SMB Flat NEP 3L

3 QueryList : RoHS Directive 2011/65/EU-July 2011 Annex II amended by Directive 2015/863-April 2015 Query 1 - Product(s) meets EU RoHS requirement without any exemptions 2 - Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply) 3 - Product(s) meets EU RoHS requirements by application of the selected exemption(s) 4 - Product(s) does not meet EU RoHS requirements and is not under exemptions Exemption Id. Description 7a Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead) Response FALSE FALSE TRUE FALSE QueryList : California Prop65 list, dated 15th December 2017 Query Response 1 - The product does not contain identified substance from California Prop 65 List, no exposure to consumers is foreseen 2 - The product is containing below substance(s) from California Prop 65 List, no exposure to consumers is foreseen FALSE TRUE Substance amount in product (mg) Application ppm in product Nickel Lead Lead-Borate Glass 0.01 Die Soft solder Die 3613 QueryList : REACH-15th January 2018 Query Response 1 - Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH CategoryLevel_Name CategoryLevel_Threshold amount in product (mg) Application ppm in product true

4 Material Composition Declaration : note : Substance present with less 0.001mg will not be declared in this document Mfr Item Name ZHBJ*Z1G016R Homogeneous Material Material Group Mass UoM Level Substance Category Substance CAS Exempt Mass UoM Concentration in homogeneous material (ppm) Concentration in product (ppm) Die M-011 Other inorganic materials mg supplier die Silicon (Si) mg supplier die Silicium carbide mg supplier die Mica mg supplier die Sapphire mg supplier die Gallium Arsenide mg supplier metallization Aluminium (Al) mg supplier metallization Arsenic (As) mg supplier metallization Bore (B) mg supplier metallization Chromium (Cr) mg supplier metallization Copper (Cu) mg supplier metallization Cobalt (Co) mg supplier metallization Germanium (Ge) mg supplier metallization GeSbTe Proprietary mg supplier metallization Gold (Au) mg supplier metallization Iridium oxide mg supplier metallization Iron (Fe) mg supplier metallization Lanthane (La) mg supplier metallization Lithium (Li) mg supplier metallization Lithium Cobalt oxide mg supplier metallization Lithium phosphate mg supplier metallization Manganese (Mn) mg supplier passivation Nickel (Ni) mg supplier passivation Palladium (Pd) mg supplier passivation Phosphorus (P) mg supplier metallization Platinum (Pt) mg supplier metallization Silver (Ag) mg supplier metallization Tantalum (Ta) mg supplier metallization Tin (Sn) mg supplier metallization Titanium (Ti) mg supplier metallization Tungsten (W) mg supplier metallization Zirconium ( Zr) mg supplier Passivation Barium titanate mg supplier Passivation Hafnium oxide mg supplier Passivation Indium Tin oxide mg JIG - R Passivation Lead (Pb) mg supplier Passivation Silicon Nitride mg supplier Passivation Silicon Oxide mg supplier Passivation Strontium titanate mg SVHC Passivation Lead, Zirconate, Titanate (PZT) mg supplier back side metallization Aluminium (Al) mg supplier back side metallization Copper (Cu) mg supplier back side metallization Titanium (Ti) mg supplier back side metallization Chromium (Cr) mg supplier back side metallization Gold (Au) mg supplier back side metallization Nickel (Ni) mg supplier back side metallization Vanadium (V) mg supplier back side metallization Silver (Ag) mg supplier back side metallization Arsenic (As) mg supplier glass coating Glass : Aluminium Oxide (Al2O3) mg JIG - R glass coating Lead-Borate Glass c-I-Electrical and e mg supplier glass coating Borosilicate glass mg supplier glass coating Glass : Potassium Oxide mg supplier glass coating Glass : Sodium Oxide mg supplier glass coating Glass: Silicon Dioxide mg supplier glass Quartz mg supplier polymer die coating Polymer resist - Benzocyclobutene (BCB) mg supplier polymer die coating Polymer resist - ASAHI Proprietary mg supplier polymer die coating Polymer resist (Black resist)) Proprietary mg supplier polymer die coating Polymer resist (color, planar,µlens) Proprietary mg

5 supplier polymer die coating Polymer resist (Glue) Proprietary mg supplier polymer die coating PVDC mg supplier polymer die coating Polyimide AH 1200 Proprietary mg supplier polymer Epoxyde Bisphenol A Resin mg supplier polymer epoxypropoxy naphthalene mg supplier polymer Epoxy Cresol Novolak mg supplier polymer Phenyliodonium hexafluoroantimonate mg supplier polymer Acetophenone mg supplier polymer chloromethyl-oxirane mg supplier polymer Bisphenol A diglycidyl ether polymer mg supplier polymer die coating Durimide Proprietary mg supplier polymer die coating PIX1 Polyimide mg supplier polymer die coating PIX1 Gamma-butyrolactone mg supplier UBM Aluminium (Al) mg supplier UBM Copper (Cu) mg supplier UBM Titanium (Ti) mg supplier UBM Chromium (Cr) mg supplier UBM Gold (Au) mg supplier UBM Nickel (Ni) mg supplier UBM Vanadium (V) mg supplier UBM Silver (Ag) mg supplier UBM Tungsten (W) mg supplier bump Tin (Sn) mg supplier bump Silver (Ag) mg supplier bump Copper (Cu) mg supplier bump Nickel (Ni) mg supplier bump Antimony (Sb) mg JIG - R bump Lead (Pb) Lead in solders t mg Leadframe M-004 Copper and its alloys mg supplier alloy Copper (Cu) mg supplier alloy Iron (Fe) mg supplier alloy Phosphorus (P) mg supplier alloy Zinc (Zn) mg supplier alloy Magnesium (Mg) mg supplier alloy Silicon (Si) mg supplier alloy CopperPosphorous (CuP) mg supplier alloy Tin (Sn) mg supplier alloy Cobalt (Co) mg supplier alloy Zirconium (Zr) mg supplier alloy Chromium (Cr) mg supplier alloy Silver (Ag) mg supplier alloy Sulfur (S) mg supplier alloy Manganese (Mn) mg supplier alloy Carbon mg #N/A alloy mg #N/A alloy mg supplier tape Polyimide film Proprietary mg supplier tape Polyethylene-terephthalate film Proprietary mg supplier tape NBR(Acrylonitrilebutadiene rubber) Proprietary mg supplier tape Bismaleimide Proprietary mg supplier tape Phenol resin Proprietary mg #N/A tape mg supplier metallization Nickel (Ni) mg supplier metallization Palladium (Pd) mg supplier metallization Gold (Au) mg supplier metallization Silver (Ag) mg

6 supplier metallization Phosphorus (P) mg oui mg supplier AAA mg supplier CCC mg supplier mg ZZZ mg Die attach mg #N/A glue or tape (choose) mg Die attach mg Soft solder Solder mg JIG - R solder Lead (Pb) a-Lead in high mel mg supplier solder Silver (Ag) mg supplier solder Tin (Sn) mg Soft solder 2 Solder mg

7 Bonding wires M-011 Other inorganic materials mg supplier wire Gold (Au) mg supplier wire Copper (Cu) mg supplier wire Palladium (Pd) mg supplier wire Platinium (Pt) mg supplier wire Silver (Ag) mg supplier wire Aluminium (Al) mg supplier wire Magnesium (Mg) mg supplier wire Silicium (Si) mg Bonding Ribbons M-009 Other non-ferrous metals and a mg supplier Ribbon Aluminium (Al) mg Underfill M-015 Other organic materials mg Encapsulation M-011 Other inorganic materials mg supplier mold compound Silica, vitreous mg supplier mold compound Epoxy Resin Proprietary mg supplier mold compound Phenol Resin Proprietary mg supplier mold compound Carbon black mg supplier mold compound Bismuth compound mg BBBB mg solder paste Solder mg connections coating Solder mg supplier solder alloy Tin (Sn) mg JIG - R solder alloy Lead (Pb) mg supplier solder alloy Copper (Cu) mg supplier solder alloy Silver (Ag) mg #N/A solder alloy mg subelement mg #N/A 0 x x mg

8 #N/A 0 0 x mg subelement mg Subelement mg abcd mg efgh mg Subelement mg aaabb mg