Silicone Materials for Electronic Devices and Component Assemblies

Transcription

1 Silicone Materials for Electronic Devices and Component Assemblies

2 Contents Overview...- Industry Overview...-4 Product Index Adhesives and Sealants Grease...7 Coating Materials Encapsulants / Potting Materials...9- Selection Guide...- Product Details Part Condensation Cure...-6 Part Room Temperature. Cure...7 Part Heat (Addition) Cure...8- Part Heat (Addition) Cure...- Part & Part Gels... Junction Coating Resin (JCR) Grades...4 Grease...4 UL Certifications Technical Information FAQ...9 Silicone Product P r o fi l e The products introduced in this selector guide consist of RTV (Room Temperature Vulcanizing) silicone products that are commonly found in Electric and Electronic applications and component assemblies. This family of silicone products consists of both Room Temperature Cure and Heat (Addition) Cure grades. Momentive Performance Materials offers a comprehensive portfolio of silicone solutions to help meet a broad array of handling and performance needs in electronic components and assemblies. Selection of the appropriate type of RTV depends upon the required manufacturing process, handling RTV requirements, curing conditions, equipment, and desired material properties. Condensation Cure Condensation cure silicone products cure when exposed to moisture in the environment at room temperature. These materials are categorized into Alkoxy, Acetoxy, or Oxime based on the byproducts that occur during cure. Heat (Addition) Cure Heat cure grades cure upon exposure to elevated heat or room temperature. Part Condensation Cure Sealing & Adhesion Silicones are used in a wide array of applications for bonding components, and sealing against moisture or environmental contaminants. A comprehensive portfolio of Part and Part Adhesives and Sealants, many of which are excellent candidates for assembly applications on or near sensitive electrical and electronic components, are available. These materials are applied by a variety of methods ranging from manual dispensing to auto-dispensing units for tube, cartridge, pail, or drum packages. Mixing for Part grades may be accomplished by either manual processes or meter mix dispensing, depending on production volume and post-mix material properties. Performance Considerations - Temperature Resistance - Dielectric Resistance - Flame Retardancy - Volatility - Adhesion - Mechanical Strength - Hardness - Thermal Conductivity Process Considerations - Viscosity - Cure Mechanism - Cure Temperature - Cure Time - Pot Life Coating The Coating process involves the application of silicone in a thin protective layer to a component surface by methods such as dip, fl ow, spray, and selective Potting & Encapsulation Silicone rubber and gels are widely used in electronics to ensure mechanical and environmental protection. A full range of products are offered in various cure speeds, viscosities, and robotic coating. Selection of a silicone coating material for a particular application involves the consideration of various performance and processing criteria. Performance Considerations - Temperature Resistance - Dielectric Resistance - Flame Retardancy - Volatility Process Considerations - Viscosity - Cure Mechanism - Cure Temperature - Cure Time - Pot Life performance, many of which offer enhancements for thermal cycling protection, stress relief, material strength, fl ame retardancy, or optical clarity. Silicone Silicone Varnish Millable Silicone Rubber Silicone Oil Part Heat (Addition) Cure Condensation Cure Heat (Addition) Cure Performance Considerations - Temperature Resistance - Dielectric Resistance - Flame Retardancy - Volatility - Adhesion - Stress Relief - Release Properties - Thermal Conductivity Process Considerations Relative Performance Characteristics Property Silicone RTV Epoxy Urethane Temperature Range -5 ~ + o C -5 ~ +5 o C - ~ + o C - Viscosity - Cure Mechanism - Cure Temperature - Cure Time - Pot Life Heat Resistance Good Poor Poor Flame Retardancy Good None None UV Stability Good Poor Poor Ozone Stability Good Poor Poor Modulus High High As a base material silicone demonstrates flame retardant properties comparable to UL94HB

3 Industries Served Electronic Devices and Power Modules Momentive Performance Materials is a driving force as a supplier of advanced silicone technology to the electronics industry. Increasing electronic component densities and performance demands have created a need for specialized silicone solutions from Momentive for a broad mix of performance and handling requirements. Typical Applications: - Power converters - Inverters - Hybrid ICs - Micro-Electronic packaging - High-voltage component insulation - Membrane switches - Photo couplers Typical Applications: - Board-level adhesion, fi xing, and sealing - PCB coating - Component encapsulation - Junction Coating Resins Consumer Electronics Silicones are commonly used in a variety of consumer electronics applications. In addition to providing adhesion to many substrates, an array of grades are available to provide heat resistance, fl ame retardancy, low volatility for sensitive components, and moisture protection. Typical Applications: - Flat panel displays - PCs and Smart Phones Automotive Electronics The automotive industry plays a critical role in integrating new electronic technologies. As more and more components migrate to electronic solutions, silicones play an increasingly important role in helping deliver material solutions that contribute to design fl exibility and long-term component reliability under harsh operating conditions. Typical Applications: - ECU potting, sealing, coating - Wire connector sealing - Sealing, encapsulation in a broad range of sensors - HVAC system sealing - Vibration dampening - Headlamp assemblies Aviation and Aerospace Avionics and frame assembly needs in Aviation and Aerospace are served through silicone adhesives, coating, encapsulation and potting materials that help withstand stress and temperature extremes. Typical Applications: - Avionics - Circuit and terminal protection - Wire sealants - Engine gasketing - Cargo door, window sealing - Weatherstrip adhesives - Aviation lighting - Ventilation ducts - LED Lighting Board Assembly Silicones are found in boardlevel adhesion, coating, and encapsulation applications, and contribute to the longterm, reliable performance of many components and assemblies. A wide portfolio of products is available, providing fl ame retardancy, thermal conductivity, temperature resistance, low-volatility, or high-purity benefi ts. - Air conditioner units - Control panel insulation - PCB fi xing and sealing Energy Reliability of electronic components and the ability for panels to withstand harsh conditions over the lifecycle of the product are important considerations in solar energy applications. Momentive Performance Materials helps serve this growing industry with its range of potting materials and sealants. Typical Applications: - Terminal box potting - Box and base sealing - Aluminum frame and glass / EVA plate sealing 4

4 Product Overview: Adhesives & Sealants Type Part Condensation Cure Part Heat Cure P Heat Cure Grade Cure Chemistry Cured Property Feature Regulatory restrictions may apply to products in certain countries. Please contact a Momentive Performance Materials sales representatives for availability in specifi c regions. Performance RTV Alkoxy Rubber non-fl owable Non-fl owable UL94 V- P. RTV67 Alkoxy Rubber High-strength paste adhesive with UL certifi cation and Mil Spec. Non-fl owable UL94 HB MIL-A-4646B P. TSE85 Alkoxy Rubber Paste adhesive. Non-fl owable P. TSE85-W Alkoxy Rubber, semi-fl owable paste. Semi-flowable UL94 V- P. 4 TSE854DS Alkoxy Rubber paste adhesive. Non-fl owable UL94 V- P. TN5 Alkoxy Rubber Fast tack, low volatile paste paste adhesive. Non-fl owable UL94 HB P. TN85 Alkoxy Rubber Fast tack, low volatile paste paste adhesive. Non-fl owable UL94 V- P. TSE94M Alkoxy Rubber Fast tack, thermally conductive fl owable Flowable P. 4 TSE944 Alkoxy Rubber volatile, fl owable Semi-flowable UL94 V- P. 4 TN5 Alkoxy Rubber Fast tack, low volatile fl owable adhesive / Flowable UL94 HB P. 4 TSE97 Alkoxy Rubber Flowable adhesive / Flowable P. 4 TSE976-B Alkoxy Rubber volatile, temperature resistant. Flowable UL94 HB P. 4 XE-B5 Alkoxy Rubber Fast tack, low volatile, thermally conductive adhesive.. Non-fl owable UL94 HB P. TSE7 Acetoxy Rubber Fast tack, general purpose paste adhesive. Non-fl owable P. 6 TSE8 Oxime Rubber Fast tack, general purpose adhesive paste.. Non-fl owable UL94 HB P. 5 TSE86 Oxime Rubber Fast tack adhesive for high-temperature applications. Non-fl owable P. 5 TSE84-W Oxime Rubber general purpose adhesive / Semi-flowable UL94 V- P. 6 TSE84-B Oxime Rubber general purpose adhesive / Non-fl owable UL94 V- P. 6 TSE87 Oxime Rubber General purpose fl owable adhesive / Flowable P. 6 TSE877-B Oxime Rubber Flowable sealant for high-temperature applications. Flowable P. 6 TSE88 Oxime Rubber Flowable general purpose adhesive / Flowable P. 6 TSE Heat Rubber Thixotropic adhesive / Semi-flowable P. 8 TSE Heat Rubber Flowable adhesive /. Flowable UL94 HB P. 8 TSES Heat Rubber Flowable adhesive / Flowable P. 9 TSES Heat Rubber Semi-fl owable adhesive / Semi-flowable P. 8 TSE6 Heat Rubber, high temperature-resistant adhesive / Flowable UL94 HB P. 9 TSE6-G Heat Rubber High temperature-resistant adhesive / Flowable P. 8 TSE6M Heat Rubber High temperature-resistant adhesive / Flowable P. TSE8-G Heat Rubber Thermally conductive adhesive. Flowable P. 9 TSE8-G Heat Rubber Thermally conductive adhesive. Flowable P. 9 XE-B8 Heat Rubber General purpose adhesive / Non-fl owable P. 8 LA65S Heat Rubber Adhesive that cures to a tough silicone elastomer. Non-fl owable P. 8 TSE6 Heat Rubber General purpose adhesive / sealant with extended pot life. Non-fl owable P. TSE8 Heat Rubber Thermally conductive adhesive. Fast cure at elevated temperatures. Flowable P. TSE6M-EX in Europe and the Americas Flowability Flame Retardancy Volatility Thermally Conductive High Temp. Resistance Temp. Resistance FDA Compliant MIL-Spec Product Detail 5 6

5 Product Overview: Coating Materials Type Part Condensation Cure Part Heat Cure Part Heat Cure Grade Cure Chemistry Cured Property Feature Regulatory restrictions may apply to products in certain countries. Please contact a Momentive Performance Materials sales representatives for availability in specifi c regions. Performance ECC Alkoxy Rubber Fast cure conformal coating material. Solvent free Flowable P. 5 ECC5S Alkoxy Rubber Fast cure conformal coating material. volatile. Solvent free Flowable P. 5 ECS6 Alkoxy Rubber High purity repairable electrode coating. Fast tack. Flowable P. 5 ECS6 Alkoxy Rubber High purity, non-repairable type electrode coating. UL certified. Flowable UL94 HB P. 5 RTV6 Alkoxy Rubber UL certified flowable Flowable UL94 HB P. 4 TSE94M Alkoxy Rubber Fast tack, thermally conductive flowable Flowable P. 4 TSE944 Alkoxy Rubber volatile, UL certified flowable Semi-flowable UL94 V- P. 4 TN5 Alkoxy Rubber Fast tack, low volatile flowable adhesive / UL certified. Flowable UL94 HB P. 4 TSE97 Alkoxy Rubber Flowable Flowable P. 4 TSE976-B Alkoxy Rubber volatile, temperature resistant UL certified. Flowable UL94 HB P. 4 TSE98 Alkoxy Rubber Pourable coating / encapsulant. Flowable P. 4 TN75 Alkoxy Rubber volatile, low viscosity coating / potting material. Flowable UL94 HB P. 5 XE-A5S Alkoxy Rubber volatile, UL certified, thermally conductive coating & potting. Flowable UL94 V- P. 4 TSE87 Oxime Rubber General purpose flowable sealant / coating. Flowable P. 6 TSE877-B Oxime Rubber Flowable sealant for high-temperature applications. Flowable P. 6 TSE88 Oxime Rubber Flowable, general purpose sealant / coating. Flowable P. 6 TSE89 Oxime Rubber Flowable, UL certified coating / Flowable UL94 HB P. 6 ECC4865 Heat Rubber Extreme low viscosity coating material with UV tracer. Flowable P. TSES Heat Rubber Flowable sealant / coating material. Flowable P. 9 TSE5 Heat Rubber Flowable coating / encapsulant. Flowable P. TSE5 Heat Rubber Flowable coating / encapsulant. Flowable P. TSE5 Heat Rubber Flowable coating material. Semi-flowable P. TSE5-C Heat Rubber Flowable coating material. Semi-flowable P. TSE5-B Heat Rubber Flowable coating / encapsulant. Flowable P. TSJ55 Heat Rubber High purity JCR-grade white rubber. Semi-flowable P. 4 TSJ95-W Heat Gel High purity JCR-grade white gel. Semi-flowable P. 4 TSJ85 Heat Gel High purity JCR-grade translucent gel. Semi-flowable P. 4 TSJ87 Heat Gel High purity JCR-grade translucent gel. Semi-flowable P. 4 TSE Heat Rubber Transparent coating / encapsulant. Fast cure at elevated temperatures. Flowable P. TSE Heat Rubber UL certified, thermally conductive, coating / encapsulant. Flowable UL94 V- P. TSEK Heat Rubber viscosity variant of TSE. Flowable UL94 V- P. TSEK EX Heat Rubber viscosity variant of TSE. Flowable UL94 V- P. XE4-B5778 Heat Rubber High purity JCR-grade translucent rubber. Semi-flowable P. 4 TSJ75 Heat Gel High purity JCR-grade thixotropic gel. Semi-flowable P. 4 TSEK for Asia Pacifi c, TSEK EX for Europe and the Americas Flowability Flame Retardancy Volatility Thermally Conductive High Temp. Resistance JCR Grade FDA Compliant MIL-Spec Product Detail Grease - Product Index Grade Feature Thermally Conductive Bleed Performance Volatility Heat Resistant Product Detail TSK5 Moderate thermal conductivity with heat resistance P. 4 TSK57 General electrical insulation. Swell resistant on silicone P. 4 TSK55 General electrical insulation, arc resistance. P. 4 TSK55 Insulator protection from salt, dust. P. 4 YG6 Moderate thermal conductivity. P. 4 YG64 Moderate thermal conductivity, low-bleed performance P. 4 YG66 Moderate thermal conductivity. P. 4 TIG High thermal conductivity. P

6 Product Overview: Encapsulants and Potting Materials Type Part Cond. Cure Part Heat Part Cure RT Part Heat Cure Cure Grade Cure Chemistry Cured Property Feature Flowability Flame Retardancy Volatility Thermally Conductive Regulatory restrictions may apply to products in certain countries. Please contact a Momentive Performance Materials sales representatives for availability in specifi c regions. Performance RTV6 Alkoxy Rubber UL certified flowable encapsulant. Flowable UL94 HB P. 4 TSE98 Alkoxy Rubber Pourable coating / encapsulant. Flowable P. 4 TN75 Alkoxy Rubber volatile, low viscosity potting / coating material. Flowable UL94 HB P. 5 XE-A5S Alkoxy Rubber volatile, UL certified, thermally conductive coating & potting. Flowable UL94 V- P. 4 TSE5 Heat Rubber Flowable coating / encapsulant. Flowable P. TSE5 Heat Rubber Flowable coating / encapsulant. Flowable P. TSE5-B Heat Rubber Flowable coating / encapsulant. Flowable P. TSE5 Heat Gel viscosity potting gel. UL certified Flowable P. TSE5-FR Heat Gel UL certified variant of TSE5. Flowable UL94 V- P. TSE5-L Heat Gel penetration variant of TSE5. Flowable P. TSE66 Condensation Rubber Flowable encapsulant / potting material. Flowable P. 7 TSE66 Condensation Rubber Flowable encapsulant / potting material. Flowable UL94 HB P. 7 TSE664K Condensation Rubber UL certified, flowable encapsulant / potting material. Flowable UL94 V- P. 7 RTV65 Heat Rubber High strength potting material. Fast cure at elevated temperatures. Flowable P. TSE Heat Rubber Transparent potting / encapsulant with excellent release properties. Flowable P. TSE Heat Rubber viscosity, transparent potting material. Fast cure at elevated temperatures Flowable P. TSE Heat Rubber UL certified, thermally conductive, coating / encapsulant. Flowable UL94 V- P. TSEK Heat Rubber viscosity variant of TSE. Flowable UL94 V- P. TSEK EX Heat Rubber viscosity variant of TSE. Flowable UL94 V- P. TSE4 Heat Rubber UL certified, thermally conductive potting material. Release capability. Flowable UL94 V- P. TSE4-H Heat Rubber UL certified, thermally conductive potting material. Release capability. Flowable UL94 V- P. XE4-B789 Heat Rubber UL certified low-viscosity potting material. temperture cure. Release capability Flowable UL94 V- P. YE58 Heat Rubber viscosity potting material. Good release properties. Flowable P. TIA6G Heat Rubber Thermally conductive, low temperature / fast cure soft pottant. UL certified Flowable UL94 V- P. TIAG Heat Rubber Thermally conductive, low temperature / fast cure soft pottant. UL certified Flowable UL94 V- P. RTV66-D Heat Gel viscosity potting gel with fast cure at low temperatures. Flowable P. TSE6 Heat Gel Fast cure at low temperatures. Flowable P. TSE7 Heat Gel High-elongation gel with low temperature cure. Flowable P. TSEK for Asia Pacifi c, TSEK EX for Europe and the Americas High Temp. Resistance Temp. Resistance FDA Compliant MIL-Spec Product Detail 9

7 Selection Guide Part Grades Viscosity Range Non- Flowable High Viscosity Medium Viscosity Viscosity Thermally Conductive BLACK=Rubber RED=Gels Volatility UL Certified Alkoxy Acetoxy Oxime Heat Performance Temp. Resistant FDA Compliant General Purpose TN85 TN5 TSE854DS TSE85 XE-B5 TN85 TN85 XE-B5 TN5 RTV RTV67 TSE7 TSE8 TSE86 TSE84-B XE-B8 TSE976-B TSE85-W TSE976-B TSE97 TSE976-B TSE84-W TSE84-W TSE877-B TSE TSE TSE94M TSE944 TSE944 TSE98 XE-A5S XE-A5S XE-A5S TN5 RTV6 TN5 TSE87 TSE88 TSE8-G TSE5 TSE6 TSES TSE8-G TSE6-G TSE6M ECC5S ECS6 ECS6 ECC ECS6 ECC5S TN75 TN75 TSE89 TSE5FR TSE5-L TSE5 TSE5 TSE5 TSE5 TSE5-C TSE5-B Part Grades Viscosity Range Non-Flowable Medium Viscosity Viscosity Non-Flowable High Viscosity Flowable Thermally Conductive Volatility BLACK=Rubber RED=Gels UL Certified Performance Temp. Resistant Viscosity and fl owability of the silicone material are often key factors in the selection of a material for use in sealing, coating, and encapsulation / potting applications. A broad array of material performance and viscosity combinations are provided to help match the requirements of many applications. Heat FDA Compliant Room Temperature General Purpose TSE6 TSE8 TSE TIAG TSE RTV65 RTV66-D TSEK TIA6G TSEK TSE TSE4 TSE4 TSE TSE4-H TSE4-H TSE6 TIAG XE4-B789 TSE7 TIA6G TIAG TSE TIA6G YE58 TSE66 TSE66 TSE664K Medium Viscosity Flowable Viscosity Flowable Application Geometry and Cure Chemistry Options The shape and conditions of the part are important in selecting the suitable silicone grade for each application. The following are some general guidelines: Cure System Performance Guide Attribute Alkoxy Fast Cure Slow Cure Acetoxy Oxime Heat Cure Shallow Cavity / Small Mass Complex Design - Exposed Surface Deep Cavity / Large Mass Enclosed System Cure Byproduct Alcohol Alcohol Acetic Acid Methylethyl Ketoxime Cure Speed Fast Slow Fast Moderate Very Fast None 6mm 6mm mm mm mm 5mm Corrosion on Copper None None Yes Yes None Corrosion on Metals None None Yes None None Odor Strong None Strength Good Good Very Strong Good Good Selection Options: - Part Condensation Cure - Part Heat Cure - Part Room Temp. Cure - Part Heat Cure Selection Options: - Part Heat Cure - Part Room Temp. Cure - Part Heat Cure Selection Options: - Part Heat Cure - Part Room Temp. Cure - Part Heat Cure Selection Options: - Part Heat Cure - Part Heat Cure

8 Product Details - Part Condensation Cure Grades Properties RTV67 RTV TSE85 TSE854DS TN5 TN85 XE-B5 TSE944 TSE85-W TSE97 TSE976-B XE-A5S TSE94M TN5 RTV6 TSE98 Cure Chemistry Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Flowability Non-Flowable Non-Flowable Non-Flowable Non-Flowable Non-Flowable Non-Flowable Non-Flowable Semi-Flowable Semi-Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Features and Benefits Application Color Packaging High strength, paste adhesive with MILA- 466B and UL certifi ed paste adhesive. Paste adhesive Paste adhesive. Fast tack, low volatile Fast tack, low volatile paste adhesive. paste adhesive. Fast tack, low volatile, thermally conductive paste adhesive. Flowable low volatile adhesive / Flowable adhesive / Flowable adhesive / Flowable, high-temperature resistant low volatile adhesive / UL certified Flowable, low volatile thermally conductive potting conductive fl owable / coating material. UL certified Fast tack, thermally Fast tack, low volatile, Flowable adhesive. Adhesive / Sealant Coating Encapsulant / Potting Viscosity ( o C) Pa.s (P) (4) () () 6 (6) 5 (5) 47 (47) 8 (8) 7 (7) Application Rate g/min Tack Free Time min Specific Gravity ( o C) Hardness Tensile Strength MPa (psi) 5.5 (8) 4.5 (65).9 (4). (45).8 (6). (5).6 (5).5 (). (5).5 ().7 (45).9 (565). (465).5 ().9 (75). (9) Elongation % Adhesive Strength MPa (psi). (75) -. (9). (). (75). (9). (9). (45). (9). (6). (9). (9).4 (5). (45) -.7 () Thermal Conductivity W/m.K Volume Resistivity MΩ.m.x 7.x 7 5.x 7.x 6.x 7 4.x 6.x 7.x 7.x 6.x 7.x 7 4.x 6 4.x 6.x 7 4.x 6.x 7 Dielectric Strength kv/mm Dielectric Constant (6Hz).8.8 (Hz) Dissipation Factor (6Hz).6. (Hz) Molecular Siloxane (D4-D) wt% Flame Retardancy UL94 HB UL94 V- UL94 V- UL94 HB UL94 V- UL94 HB UL94 V- UL94 V- UL94 HB UL94 V- UL94 HB UL94 HB adhesive / Volatility Temperature Resistance Thermally Conductive MIL-Spec MIL-A-466B White Clear Black Gray Tube Cartridge Can See Page 5 for details JIS K 649 Testing is performed in accordance with current Momentive Performance Materials quality test methods, laboratory conditions, procedures, frequency and sampling. MIL-A-466B Group I Type I Typical property data values should not be used as specifi cations fl owable adhesive / UL certified Flowable adhesive / Cure Properties: Condensation cure grades cure with exposure to atmospheric moisture. The cure process begins from the outer surface and proceeds inward. Therefore, deep section curing (in excess of 6mm) is not recommended. Typically, tack-free is achieved in 5-6 minutes at 5 o C, 5%RH, depending on the grade. Cure Depth mm TN5 (Alkoxy) Cure Time h o C, 6%RH o C, 5%RH o C, %RH 7 Cure Depth mm TSE8 (Oxime) Cure Time h 5 o C, 9%RH 5 o C, 6%RH 5 o C, %RH o C, 6%RH o C, %RH o C, 9%RH o C, 6%RH o C, %RH o C, 9%RH Cure Depth mm TSE7 (Acetoxy) 5 o C, 9%RH 5 o C, 6%RH 5 o C, %RH o C, 9%RH o C, 6%RH o C, %RH o C, 9%RH o C, 6%RH o C, %RH Cure Time h Adhesion is typicaly achieved after 5-5 hours. Full material properties including electronic performance, is achieved in up to 7 days. Shear Adhesive Strength MPa.4... Manifestation of Adhesion TN5 (Alkoxy) TSE8 (Oxime) TSE85 (Alkoxy) Cure Time h 4

9 Product Details - Part Condensation Cure Grades Properties ECS6 TN75 ECS6 ECC5S ECC TSE8 TSE86 TSE84-B TSE84-W TSE877-B TSE87 TSE88 TSE89 TSE7 Cure Chemistry Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Oxime Oxime Oxime Oxime Oxime Oxime Oxime Oxime Acetoxy Flowability Flowable Flowable Flowable Flowable Flowable Flowable Non-Flowable Non-Flowable Semi-Flowable Flowable Flowable Flowable Flowable Non-Flowable Features and Benefi ts Application Color Packaging High-purity electrode coating material with and coating material. fast tack performance. Repairable type volatile potting High-purity electrode coating material with fast tack performance Fast cure conformal coating material. volatile. Solvent free Fast cure conformal coating material. Solvent free General purpose paste adhesive. High temperature resistant paste adhesive General purpose paste adhesive. General purpose fl owable adhesive / General purpose fl owable adhesive / General purpose fl owable adhesive / General purpose fl owable adhesive / Flowable sealant / coating material. UL Adhesive / Sealant Coating Encapsulant / Potting Viscosity ( o C) Pa.s (P) 5. (5).5 (5).4 (4).55 (5.5). (.) (5) () 6 (6) () 5.6 (56) - Application Rate g/min Tack Free Time min Specifi c Gravity ( o C) Hardness Tensile Strength MPa (psi). (75).4 (6).8 (5) (75). (9).9 (4).9 (565). (9). (5).5 (). (9).5 (65) Elongation % Adhesive Strength MPa (psi) -. (). (45) (45).4 (5).4 ().8 (6). (9). (9). (9).8 (6). () Thermal Conductivity W/m.K Volume Resistivity MΩ.m 4.x 7.x 7.x 7.x 7.x 7.x 7.x 7.x 7.x 7.x 7.x 7.x 7.x 7.x 7 Dielectric Strength kv/mm 6 Dielectric Constant (6Hz) Dissipation Factor (6Hz) Molecular Siloxane (D4-D) wt% Flame Retardancy UL94 HB UL94 HB V- V- UL94 HB UL94 V- UL94 V- UL94 HB Volatility Temperature Resistance Thermally Conductive White Clear Black Red Tube Cartridge Can Pail See Page 5 for details JIS K 649 Typical property data values should not be used as specifi cations certifi ed Fast tack paste adhesive Packaging Supplement Grade Tube Cartridge Can Pail W C B W C B G W C B W C B TN5 TN5 TN75 TSE87 TSE89 W: White, C: Clear, B: Black, G: Gray 5 6

10 Product Details - Part Room Temperature Cure Grades Properties TSE66 TSE66 TSE664K Components TSE66(A) TSE66(B) TSE66(A) TSE66(C) TSE664(A) TSE664(B) Flowability Flowable Flowable Flowable Flowable Flowable encapsulant Flowable encapsulant Features and Benefi ts encapsulant / / adhesive with fast / adhesive with fast adhesive tack free times. tack free times. UL certified UL certified Adhesive / Sealant Coating Application Packaging Encapsulant / Potting Mixing Ratio ((A):(B) by weight) : : :7.5 Color (mixed) Off-White Blue Green Gray Viscosity (mixed) ( o C) Pa.s (P) 4. (4).5 (5). () Pot Life ( o C) h.5.. Cure Condition o C/h /7 /7 /7 Specifi c Gravity ( o C).9..4 Hardness 4 6 Tensile Strength MPa (psi).4 (5). (6). (45) Elongation % 7 Adhesive Strength MPa (psi).9 ().8 (5). (45) Thermal Conductivity W/m.K Volume Resistivity MΩ.m.x 7.x 7 5.x 7 Dielectric Strength kv/mm 6 Dielectric Constant (6Hz)... Dissipation Factor (6Hz).5.. Flame Retardancy UL94 HB UL94 V- Bottle Can Pail JIS K 649 Typic al proper t y dat a values should not be used as spec i fi c ations Cure Speed: The cure speed of Part Condensation Cure grades can be changed by adjusting the amount of the catalyst component. However, the post-cure properties of the material may vary from those achieved under standard mixing ratios, and therefore adequate testing and confirmation prior to use in an application is required. TSE66 - Mixing Ratios & Viscosity ( o C) Viscosity Pa. s :.5 :. Time - h :.5 Product Details - Part Heat Cure Grades Properties XE-B8 TSE LA65S TSE TSES TSE6-G Flowability Non-Flowable Semi-Flowable Non-Flowable Semi-Flowable Semi-Flowable Flowable Features and Benefi ts Cure Properties: The cure performance of Part Heat Cure grades is demonstrated by the relationship between temperature and hardness, and temperature and adhesive strength of TSE when placed in an oven at temperatures ranging from 8 o C to 5 o C. Paste adhesive / Hardness & Cure Time - TSE Hardness sealant o C o C Thixotropic adhesive / sealant o C 8 o C 4 5 Cure Time h Non-fl owable adhesive that cures to a tough silicone elastomer Flowable adhesive / Adhesion & Cure Time - TSE Shear Adhesive Strength MPa Flowable adhesive / 5 o C o C o C 8 o C 4 5 Cure Time h High temperature resistant fl owable adhesive / sealant Adhesive / Sealant Coating Encapsulant / Potting Viscosity ( o C) Pa.s (P) 67 (67) 8 (8) 5 (5) () 7 (7) 5 (5) Cure Condition o C/h 5/ 5/ 5/.5 5/ 5/ 5/ Specifi c Gravity ( o C) Hardness Tensile Strength MPa (psi) 4.4 (64).7 (55) 6.5 (95).4 (495).6 (5) 4.9 (7) Elongation % Adhesive Strength MPa (psi).7 (55).6 (75) 5. (7).5 (65).5 (65). (9) Thermal Conductivity W/m.K Volume Resistivity MΩ.m.x 7.x 7 6.x 7.x 7.x 7.x 7 Dielectric Strength kv/mm 5 Dielectric Constant (6Hz) Dissipation Factor (6Hz) Flame Retardancy UL94 HB Temperature Resistance Thermally Conductive White Clear Black Gray Blue Tube Cartridge Can Pail JIS K 649 Typical property data values should not be used as specifi cations Application Color Packaging

11 . Product Details - Part Heat Cure Grades Properties TSE8-G TSE8-G TSES TSE6 TSE6M TSE5 TSE5-C TSE5 TSE5-B TSE5 ECC4865 Flowability Flowable Flowable Flowable Flowable Flowable Semi-Flowable Semi-Flowable Flowable Flowable Flowable Flowable Thermally Thermally conductive Flowable adhesive High temperature High temperature Flowable coating Flowable coating Flowable potting / Flowable potting / Flowable potting / viscosity conformal Features and Benefi ts conductive fl owable adhesive / sealant, coating resistant fl owable resistant fl owable material material coating material coating material coating material coating with UV tracer, fast fl owable adhesive material adhesive. UL adhesive thermal cure & long-term certifi ed viscosity stability Adhesive / Sealant Coating Encapsulant / Potting Viscosity ( o C) Pa.s (P) 6 (6) 6 (6) 58 (58) 8 (8) 6 (6) 8.5 (85) 7. (7) 4. (4).5 (5). ().5 (.5) Application Color Packaging Cure Condition o C/h 5/ 5/ 5/ 5/ /.5 5/ 5/ 5/ 5/ 5/ - Specifi c Gravity ( o C) Hardness Tensile Strength MPa (psi). (465) 4.5 (655).8 (45).4 (495).9 (4).7 ().7 ().7 ().9 () - - Elongation % Adhesive Strength MPa (psi). (9).5 (65).5 (65). (9).5 ().4 (6).4 (6).4 (6).4 (6). (5) - Thermal Conductivity W/m.K Volume Resistivity MΩ.m.5x 6 4.8x 6 6.x 7.x 7.x 7.x 7.x 7.x 7.x 7.x 7 - Dielectric Strength kv/mm 5 Dielectric Constant (6Hz) Dissipation Factor (6Hz) Flame Retardancy UL94 HB Temperature Resistance Thermally Conductive White Clear Black Gray Red Tube Cartridge Can Pail Drum JIS K 649 ASTM D96 TSE6M EX in Europe and the Americas. Typical property data values should not be used as specifi cations Storage Stability: Storage under low temperature conditions is important particularly for -part heat cure grades to prevent viscosity increase. Viscosity Pa s 4 TSE Viscosity and Storage Temperature 5 o C 5 o C 4 Storage Time months 5 6 9

12 Product Details - Part Heat Cure Grades Properties TSE6 TSE8 TIAG TIA6G RTV65 TSE TSE TSE4 TSEK EX TSEK TSE4-H XE4-B789 YE58 TSE Components TSE6(A) TSE6(B) TSE8(A) TSE8(B) TIAG(A) TIAG(B) TIA6G(A) TIA6G(B) RTV65(A) RTV65(B) TSE(A) TSE(B) TSE(A) TSE(B) TSE4(A) TSE4(B) TSEKEX(A) TSEKEX(B) TSEK(A) TSEK(B) TSE4-H(A) TSE4-H(B) XE4-B789(A) XE4-B789(B) YE58(A) YE58(A) TSE(A) TSE(B) Flowability Non-Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable General purpose Thermally Thermally Thermally viscosity encapsulant Transparent Thermally conductive Encapsulant / potting Thermally conductive Thermally conductive Encapsulant / potting Encapsulant / potting viscosity transparent viscosity Features and Benefi ts paste adhesive with conductive conductive, low conductive, low / potting material with encapsulant / potting encapsulant / potting material with, encapsulant / potting encapsulant / potting material with, material with, encapsulant / potting transparent extended pot life adhesive temperature/fast temperature/fast capability to cure at RT. material with good material. thermal conductivity, and material. material. thermal conductivity, and low temperature cure, and material. Good encapsulant / potting cure, cure FDA recognition release properties UL certified good release properties UL certified UL certified good release properties good release properties release properties material Adhesive / Sealant Coating Encapsulant / Potting Mixing Ratio ((A):(B) by weight) : : : : : : : : : : : : : : Application Packaging Color (mixed) White Gray Gray Gray Transparent Transparent Gray Black Dark Gray Dark Gray Black Black Transparent Transparent Viscosity (mixed) ( o C) Pa.s (P) 64 (64) 4 (4) () 8 (8) 4. (4) 4. (4).5 (5). (). ().6 (6).6 (6). (). ().9 (9) Pot Life ( o C) h Cure Condition o C/h 5/ 5/.5 7/.5 7/.5 5/.5 / / / / / / 6/ / 5/.5 Specifi c Gravity ( o C) Hardness (type E) 45 (type E) Tensile Strength MPa (psi) 5.4 (785).5 (65). (44). (9) 6. (9) 4.5 (655).9 (4) 4.9 (7). (44). (45) 4. (595).5 (5).4 (58). (45) Elongation % Adhesive Strength MPa (psi). (45).5 () (9) -.6 ().6 () (44) Thermal Conductivity W/m.K Volume Resistivity MΩ.m.x 7.x 6 4.8x 6 4.8x 6.8x 7.x 7.x 6 5.x 7 6.x 6 6.x 6 5.x 6.x 7.x 7.x 7 Dielectric Strength kv/mm Dielectric Constant (6Hz) (khz) Dissipation Factor (6Hz) (khz) Molecular Siloxane (D4-D) wt%.. Flame Retardancy UL94 V- UL94 V- UL94 V- UL94 V- UL94 V- UL94 V- UL94 V- UL94 V- Thermally Conductive FDA Bottle Can Pail Kit JIS K 649 TSEK unavailable in Europe and the Americas TSEK EX unavailable in Asia Pot Life: The pot life of a Part Heat Cure grade is affected by changes in viscosity that occur after the components have been mixed. Viscosity Pa. s 5 4 TSE Viscosity Change After Mixing o C Time - h Cure Properties: The cure performance of Part Heat Cure grades is demonstrated by the relationship between temperature and hardness of TSE8 when placed in an oven at temperatures ranging from o C to 5 o C. Hardness & Cure Time - TSE8 Hardness o C o C o C Viscosity Pa. s TSE4-H Viscosity Change After Mixing o C 5 6 Cure Time - min Time - h

13 Product Details - Part Gels Properties TSE5 TSE5-FR TSE5-L Flowability Flowable Flowable Flowable Features and Benefi ts viscosity viscosity, UL certifi ed viscosity, low penetration Viscosity ( o C) Pa.s (P).7 (7).7 (7).7 (7) Cure Condition o C/h 5/ 5/ 5/ Specifi c Gravity ( o C) Penetration Thermal Conductivity W/m.K Volume Resistivity MΩ.m.x 7 5.x 7.x7 Dielectric Strength kv/mm Dielectric Constant (6Hz) Dissipation Factor (6Hz)... Flame Retardancy UL94 V- White Transparent kg can See adjacent matrix 5kg can Color Pkg JIS K 649 Typical property data values should not be used as specifi cations Product Details - Part Gels Properties TSE6 TSE7 RTV66-D Components TSE6(A) TSE6(B) TSE7(A) TSE7(B) RTV66(A) RTV66(B) Flowability Flowable Flowable Flowable Features and Benefi ts temperature cure High elongation gel Fast cure, low viscosity Mixing Ratio ((A):(B) by weight) : : : Color (mixed) Transparent Transparent Transparent Viscosity (mixed) ( o C) Pa.s (P). ().8 (8).75 (7.5) Pot Life ( o C) h 4.5 Cure Condition o C/h 7/.5 7/.5 /. Specifi c Gravity ( o C) Penetration Thermal Conductivity W/m.K Volume Resistivity MΩ.m.x 7.x 7.x 7 Dielectric Strength kv/mm Dielectric Constant (6Hz) (khz) Dissipation Factor (6Hz)... (khz) Pkg Can Pail JIS K 649 ASTM D96 Typical property data values should not be used as specifi cations TSE5 W C kg bottle 4kg can 5kg can kg pail W: White, C: Clear Product Details - Part & Part JCR Grades Properties TSJ87 TSJ55 TSJ95-W TSJ85 XE4-B5778 TSJ75 Parts Part Part Part Part Part Part Components XE4-B5778(A)XE4-B5778(B) TSJ75(A) TSJ75(B) Flowability Semi-Flowable Semi-Flowable Semi-Flowable Semi-Flowable Semi-Flowable Semi-Flowable Features and Benefi ts Thixotropic JCR gel. Provides stress and vibration relief performance Thixotropic JCR rubber. post-cure hardness contributes to stress relief of critical components viscosity JCR gel. Provides stress and vibration relief performance Thixotropic JCR gel. Provides stress and vibration relief performance Flow-controllable JCR rubber. Thixotropic JCR gel. Soft gel property contributes to stress and vibration relief Property Gel Rubber Gel Gel Rubber Gel Mixing Ratio ((A):(B) by weight) : : Viscosity ( o C) Pa.s (P) () 6 (6) 4 (4) () 4 (4) 7 (7) Color Translucent White White Translucent Translucent Black Pot Life ( o C) h Cure Condition o C/h 5/4 5/4 5/4 5/4 8/ 5/ Specifi c Gravity ( o C) Hardness Penetration Thermal Conductivity W/m.K Volume Resistivity MΩ.m 5.x 7.x 7.x 7.x 7.x 5.x 7 Dielectric Strength kv/mm Dielectric Constant (6Hz) Dissipation Factor (6Hz) Na + K + ppm < < < < < < Pkg: 5g bottle JIS K 649 Typical property data values should not be used as specifi cations Product Details - Grease Properties TSK5 TSK57 TSK55 TSK55 YG6 YG64 YG66 TIG Features and Benefi ts Thermally conductive compound for medium heat dissipation. Heat & sealing with swell resistant resistance Compound for electrical insulation performance Compound for electrical Compound for electrical Thermally conductive Thermally conductive Thermally conductive Thermally conductive contact insulation protection against contact insulation protection against moisture & contaminantsmoisture & contaminants compound for medium compound for medium compound for medium compound for medium heat dissipation. heat dissipation. heat dissipation. to high heat dissipation oil separation oil separation oil separation Color White White White Green White White White White Specifi c Gravity Penetration Bleed (5 o C, 4h) % Evaporation (5 o C, 4h) % Thermal Conductivity W/m.K applications Volume Resistivity MΩ.m -.x 5.x 7.x 7.x 6.x 6.x 7.x 6 Dielectric Constant (6Hz) Dissipation Factor (6Hz) Molecular Siloxane (D4-D) wt% Arc Resistance s - - < < Volatility Temperature Resistance Thermally Conductive Bleed Tube Can Pail Package Typical property data values should not be used as specifi cations 4

14 UL Certifications source: Underwriters Laboratories Inc. Type Grade Color Thickness mm Elec. RTI Mech. Flame Class HWI HAI HVTR D495 CTI File No. Type Grade Color Thickness mm Elec. RTI Mech. Flame Class HWI HAI HVTR D495 CTI File No. Part Condenstaion Cure ECS6 Black Clear White HB - - TN5 TN85 RTV RTV6 RTV67 TSE8 TSE86 TSE84-W TSE84-B TSE85-W TSE854DS TSE89 TSE944 TSE976-B Clear White Black HB - - Clear White Black. 5 5 HB - - Gray. 5 5 V- Gray. 5 5 V- 4 White. 5 5 V- White. 5 5 V- Black V- Black V- E695 Black V- White HB 4 White HB White HB 5 E695 White. 5 5 HB - - Gray HB Gray HB 5 E695 Gray HB Clear White HB 4 Clear White HB Clear White HB 4 Clear White. 5 4 HB Red Red White. 5 5 V- - - White V- White V- - - White V- - - White. 5 4 V- - - Black. 5 5 V- Black V- - - Black. 5 4 V- - - White V- White. 5 5 V- Gray V- Gray V- Gray. 5 5 V- White V- White. 5 5 V- Clear White Black HB - - Clear White Black. 5 5 HB - - Gray V- - - White V- - - Gray White V- Gray White. 5 5 V- Black HB - - Black HB - - Black. 5 5 HB - - P Cond Cure Part Heat Cure Part XE-A5S White. 5 5 V- - - XE-B5 White HB - - White. 5 5 HB - - TSE5-FR Clear V- - - TSE TSE Blue HB - - TSE6 TSE TSEK TSEK EX TSE4 TSE4-H TSE664K XE4-B789 TSE66 Red. 5 5 HB - - Red. 5 5 HB - - Black. 5 5 V- - - Black V- Black. 5 5 V- - - Black. 5 5 V- Black V- - - Black. 5 5 V- - - Black V- - - Black. 5 5 V- - - Gray. 5 5 V- - - Gray V- - - Gray. 5 5 V- Gray V- - - Gray V- Gray. 5 5 V- - - Gray. 5 5 V- - - Gray. 5 5 V- - - Gray. 5 5 V- Black. 5 5 V- - - Black. 5 5 V- - - All. 5 5 HB 4 All. 5 5 HB TIAG Gray V- - TIA6G HWI Resistance to ignition when exposed to high temperatures. Expressed as the mean number of seconds required to ignite a specimen when wrapped with an energized ni-chrome resistive wire that dissipates a specified level of energy. Mean Ignition Time (sec) <7 PLC 4 5 Gray. 5 5 V- Gray. 5 5 V- HAI Ability to withstand electrical arcing. Expressed as the number of arc rupture exposures required to ignite a specimen when the arc occurs directly on the surface or a specifi ed distance above the test specimen. Mean No. of Arcs <5 PLC 4 Expressed as the rate (inches per minute) that a tracking path can be produced on the surface of the material under standardized test conditions. HVTR HVTR Range (in mm/min) >5 PLC 4 D495 Expressed as the Arc Resistance number of seconds that (sec) a material resists the formation of a surfaceconducting path when subjected to an - 59 intermittently occurring 4-99 arc of high voltage, low 8-9 current characteristics <6 PLC CTI Expressed as that Tracking Index voltage which causes (volts) PLC tracking after 5 drops of.% ammonium 6 chloride solution have fallen on the material < 5 RTI: Relative Temperature Index PLC: Performance Level Category HWI: Hot Wire Ignition HAI: High-Current Arc Ignition HVTR: High-Voltage Arc Tracking Rate D495: D495 High-Voltage Dry Arc Resistance CTI: Comparative Tracking Index 5 6

15 Water Solvent Oil Alkali Acid Solution Typical Adhesion Performance Condensation Cure Grades Metals Rubber Plastic Inorganic Substrate Primerless Alkoxy Acetoxy Oxime ME ME XP8-A56 Primerless ME ME Primerless ME Copper Steel Brass ME XP8-A56 Stainless Steel Aluminum Galvanized Steel Tin Acrylic Resin Phenol Resin Epoxy Resin Polycarbonate Soft Polyvinyl Chloride Rigid Polyvinyl Chloride Polyester Film Unsaturated Polyester Polyamide Nylon 66 PBT PPS ABS Polypropylene Polyethylene Fluorocarbon Resin Silicone Resin Laminate Chloroprene Rubber Nitrile Rubber Styrene Butadiene Rubber Ethylene Propylene Rubber Silicone Glass Ceramic Adheres completely, Adheres, but separates from surface when pulled, Does not adhere May corrode under some usage conditions Primer Properties Appearance Substrates Condensation Cure Addition Cure ME ME XP8-A56 SS44P SS444P SS479 ME5 XP8-B6 SS4 Yellow Transparent Metals, Glass, Plastic Yellow Transparent Plastic, Rubber Yellow Transparent Pink Yellow Clear Colorless Polylefins Metals Metals Plastic Yellow Metals, Glass, Plastic, Ceramic Yellow Transparent Metals, Glass Clear Colorless Specifi c Gravity ( O C) Non-Volatile Content 5% 5% 7% 5% 5% 6% 4% 7.5% % Drying Time ( O C) min 5 Solvents Acetone Toluene IPA Acetone Toluene IPA Toluene Acetone Xylene N-butanol IPA Acetone Xylene N-butanol IPA Ethyl Acetate Toluene Methanol Toluene IPA n-hexane - Ethanol Methanol Shear Adhesion Test Method adhesive JIS Method ASTM Method A: 5mm " B: mm.5" C: mm - Pull Rate: mm/min. "/min. Typical Chemical Resistance B substrate C Chemical Volume Change Concentrated Hydrochloric Acid Hydrochloric Acid (%) Concentrated Sulphuric Acid Decomposition Sulphuric Acid (%) Concentrated Nitric Acid Nitric Acid (7%) Glacial Acetic Acid Acetic Acid Hydrofluoric Acid Decomposition Citric Acid Phosphoric Acid Concentrated Ammonia Ammonia (%) Potassium Hydroxide (%) Sodium Hydroxide (%) Sodium Hydroxide (%) Sodium Hydroxide (5%) Sodium Chloride (%) Sodium Carbonate (%) Sodium Carbonate (%) Hydrogen Peroxide (%) ASTM No. Oil (5 o C, 7h) ASTM No. Oil (5 o C, 7h) Mineral Oil Castor Oil Flax Seed Oil Silicone Oil (5 o C, 7h) Acetone Butyl Alcohol Ethyl Alcohol Gasoline X Mineral Spirit X Toluene X Water (room temperature) Boiling Water (7h) : <%, : -5%, : 5-75%, X : >75% Test Method: Volume change of cured silicone rubber after immersing week at 5 o C Inorganic Saline A Typical Heat Resistance Hardness Chng. Adhesion Chng. % Elongation Chng. % Part Condensation Cure Adhesive (Alkoxy Type) o C 5 o C o C Typical Electrical Performance Dielectric Strength Test Method: Equipment: Dielectric voltage gauge Voltage Rise: kv/s Terminal Gap: mm (JIS C ) Elapsed Time days adhesive Electrical Performance of Cured Material TSE84-W Volume Resistivity MΩ.m mm.5mm Dielectric Strength kv/mm Conditions 4 O C, 95%RH 5 O C Immersed 4 O C, 95%RH 5 O C Immersed Initial.6x 7.6x Day.9x 6.x Days.5x 6.6x Days.7x 6.9x

16 Other Electronic Solutions from Momentive Performance Materials Provides detailed information on silicone materials used for thermal management applications in electronics and micro-electronics. Includes SilCool* grease & adhesives, and conventional grades for adhesion, encapsulation and potting. Provides opto-electronic solutions for LED Packages and Assemblies. Includes InvisiSil* LED encapsulants, Glob Top, Lens fabrication materials, Die Attach adhesives, and Dot Matrix assembly materials. Frequently Asked Questions What does RTV mean? RTV stands for Room Temperature Vulcanization (cure). Despite the low-temperature connotations conveyed by this name, RTV silicones consist of both Room Temperture Cure and Heat Cure grades. What is the cure mechanism of a condensation cure product? Condensation cure silicone products cure when exposed to atmospheric moisture. Moisture in the air is generally required to cure (or vulcanize) condensation cure products. The cure process begins from the outer surface, and therefore time is required for complete cure. The cure time is affected by the reaction mechanism and viscosity of the material. Generally, at 5C and 5%RH, condensation cure RTV silicones cure through in 4 to 48 hours. Full physical properties may take up to 7 days to develop. What is the depth (bead thickness) limit for a condensation cure grade? For -part, condensation cure products, the depth (bead thickness) limitation is approximately 6mm (/4"). For -part, condensation cure products, the depth (bead thickness) limitation is approximately 5mm ("). Can I accelerate the cure time of a -part product? Condensation cure silicone cure rates depend on humidity, silicone thickness, and to a smaller degree heat. Increasing the relative humidity around the silicone or reducing the thickness of the material will reduce the time to cure the material. Increased heat (not over 5C) will somewhat reduce cure time but as mentioned will do so to a much smaller degree than humidity or thickness. What is the cure mechanism of an addition cure product? Addition cure silicone RTV products may be or -part and cure when exposed to heat. Although some heat cure products can cure at room temperature, higher heat greatly accelerates the cure. -part heat cure products typically have an inhibitor in the formulation that stops the product from curing until an activation temperature, greater than room temperature, is achieved and the inhibitor is driven off and the cure reaction is allowed to proceed. What does "tack free time" mean? Tack free refers to the amount of time it takes for a condensation cure silicone product to form a cured outer layer (the cured outer layer is not tacky like uncured material). What is "mix ratio"? Mix ratio is a term used to state the amount of each material to be in a multi-component material. The mix ratios for -part products are described on the individual product data sheets and are given as a ratio by weight of each material. What does "pot life" or "work life" mean? The amount of time after a -part grade is mixed with its curing agent that it will remain useful or pliable. How do I remove silicone? Before it is cured: use a putty knife to remove any of the uncured paste. Wipe the area clean with isopropyl alcohol to remove any leftover residue. After it is cured: First mechanically remove as much of the silicone as you can with either a knife or a razor. A solvent (mineral spirits, toluene, xylene, acetone) can them be used to remove any oily residue or any remaining silicone, It may be necessary to soak the silicone in a solvent overnight to break it down. Can I thin a silicone? Silicone can be thinned using a solvent in which the silicone is miscible, generally an aromatic solvent such as toluene or xylene. As always, be sure to follow the producer's instructions when using solvent products and always use in a well-ventilated area. The shrinkage of the silicone and the cure time will increase with the addition of solvent. Alternative suggestions would include nonreactive fluids or an RTV with a lower viscosity. What can I do to improve the adhesion of the silicone adhesive to my parts? The first step to good adhesion is to have clean surfaces for the silicone to bond to. For difficultto-bond-substrates, Momentive Performance Materials offers a number of primers that can be used to improve and maximize adhesion. How do I ensure that air is removed from -part grades? If you are hand mixing, air may become added to the material during the mixing process. Vacuum de-airing is most effective in removing air prior to use. Automated mixing equipment that utilizes a static mixer can eliminate the need to de-air prior to dispensing. On complex high-density electronics, air can sometimes be trapped under components during the potting process. Where this is a concern, potting under vacuum or vacuum de-airing after potting can remove the trapped air. An alternate approach may be to use a grade with a low viscosity and longer potlife and to cure at lower temperatures (if heat-cure grade), allowing entrapped air to escape prior to the cure of the material. What is cure inhibition, and how do I prevent it? Cure inhibition is a phenomenon that may be observed in additioncure grades. These materials use a platinum catalyst to drive the curing reaction. Surfaces containing water, sulphur, nitrogen compounds, organic metal compounds, or phosphate compounds, may inhibit cure. Cure inhibition is characterized by a gummy or sticky appearance of the silicone at the interface between the silicone and offending substrate. Inhibition can be prevented by application of a barrier coat, cleaning of the offending material prior to application of the silicone material, replacing the offending material with a suitable alternative, or selection of a condensation cure grade. Dispensing Equipment Examples Tube Type Dispensing Unit Cartridge Air-Gun Dispensing Unit Cartridge Type Dispensing Unit Small Can Pump and Dispensing Unit Pail Can Pump Unit 9