MULTICHIP MODULE TECHNOLOGY HANDBOOK

Transcription

1 MULTICHIP MODULE TECHNOLOGY HANDBOOK Philip E. Garrou Dow Chemical Company IwonaTurlik Motorola McGRAW-HILL New York San Francisco Washington, D.C. Auckland Bogota Caracas Lisbon London Madrid Mexico City Milan Montreal New Delhi San Juan Singapore Sydney Tokyo Toronto

2 CONTENTS Preface xv Acknowledgments xvli Contributors xix Chapter 1. Technical Drivers References Introduction System Packaging Challenges Packaging Efficiency Miniaturization Reliability Future Challenges Chapter 2. MCM-C Materials, Processes, and Applications Introduction Thick Film Hybrids Thick Film Technology Photoimageable Thick Film Processing Diffusion Patteming High-temperature Cofired Alumina (HTCC) Introduction Materials for HTCC Alumina Packages Processing HTCC Ceramics HTCC Alumina MCM Conclusions Low-temperature Cofired Ceramic (LTCC) Substrates Introduction Glass-Ceramic Compositions Glass Ceramic Substrate Fabrication Future of Glass-Ceramic Substrate Technology Aluminum Nitride Introduction 2.17

3 VÜi MULTICHIP MODULE TECHNOLOGY HANDBOOK Materials for Multilayered AIN Packages AIN Materials and Greensheet Technology Typical MCM Merchant Design Rules Kyocera NTK IBM MCM-C Application Examples IBM Kyocera Unysis Fujitsu NEC Honeywell Hughes Lockheed Dassault Ceramic MCM Future Directions 2.32 References 2.32 Chapter 3. MCM-D Thin Film Materials, Processes, and Applications Introduction Construction Materials Thin Film Dielectrics Carrier Substrates Conductor Metallizations Thin Film Processing Dielectric Application and Curing Via Formation Metal Deposition and Definition Techniques Thin Film MCM Processes AT&T IBM Hughes-HDMI MMS n-chip SiCB General Electric-HDI NTK Kyocera OKI IMC Thomson Fujitsu Toshiba Reliability Copper/Polymer Interfaces Environmental Reliability Testing Application Areas Mainframe Computers Workstations, Servers, Desktops, and Portables Military and Space Telecommunication Consumer 3.68 References 3.70

4 CONTENTS ix Chapter 4. MCM-L Materials, Processes, and Applications Introduction Definition of MCM-Ls Advantages and Disadvantages of MCM-Ls Basic MCM-L Constructions MCM-Ls Using Conventional PWB Constructions Few-Chip Package Constructions MCM-D/L: Thin Film Additive MCM-L Structures Using Flexible Materials Historically Important Laminate-Based Technologies Emergence of Laser-Based Technology Options Other MCM-L Technologies Hitachi Transfer Laminate Circuit Technology Toshiba Buried Bump Interconnect Technology MCM-L Substrate Materials Organic Base Laminates Cast Films Metals and Surface Finishes Chip Attachment Area and Escape Method Underfill Chip-Size Packages Conclusions and Status 4.43 References 4.43 Chapter 5. High-Density, Large-Area Processing (LAP) Introduction and Definitions Convergence of MCM Process Technologies State of the Art Circuit Density vs. Processing Area Economic Motivations for LAP Thin Film Processing Leveraging the Fiat Panel Display Infrastructure LAP Construction Materials: Options and Limitations Substrates Dielectrics Metallization LAP Unit Operations Photoresist and Dielectric Deposition and Curing Metal Deposition and Definition Photolithography Via Generation by Laser Ablation Inspection and Electrical Test High-Density LAP Processes Sequential (on Laminate) Sequential (Nonlaminate) Conclusions and Future Trends 5.25 References 5.26 Chapter 6. 3-D Packaging Introduction Surface Mounting Techniques for Packaged Dice Multichip Module Techniques for Unpackaged Dice 6.2

5 X MULTICHIP MODULE TECHNOLOGY HANDBOOK 6.2 Classification Bare Die Assembly vs. Packaged Die Assembly Multichip Module Assembly Stacked Wafer Assembly Stacked Heterogeneous Parts Microsystems Manufacturing Techniques Bare Die Assembly Packaged Die Assembly Multichip Module Assembly Stacked Wafer Assembly Stacked Heterogeneous Parts Microsystems Cost Conclusion 6.32 References 6.35 Chapter 7. MCM Package Design Introduction Mechanical Design Considerations for MCM Packages Package Size Package I/O Expansion Matching Compliant Leads Vibration and Shock Considerations Electrical Design Considerations for MCM Packages Package Lead Characteristics Package Body Electrical Characteristics Thermal Design Considerations for MCM Packages Temperature Extreme Considerations Temperature Rise inside MCM Packages Environmental Design Considerations for MCM Packages Thermal Cycling Hermeticity Considerations Pressure Cycling Hermetic-Equivalent Packaging, Moisture and Corrosion Resistance, Reliability without Hermeticity Examples of MCM Package Design Approaches Premolded Plastic MCM Packages Postmolded Plastic MCM Packages Encapsulated Chip-on-Board MCM Packages Metal Hermetic MCM Packages Ceramic Hermetic MCM Packages Cost Considerations for MCM Packaging 7.37 References 7.42 Chapter 8. Assembly Introduction Facilities and Handling Electrostatic Discharge Die Attachment Epoxy 8.10

6 CONTENTS xi Polyimides Thermoplastics Solder Other Die Attach Materials Wire Bonding Thermosonic Wire Bonding Ultrasonic Wire Bonding Wire Bond Quality Wire Bonding Equipment Bonding Wire Substrate Metallization and Reliability Considerations Plasma Cleaning Rework Wire Bond Summary Tape Automated Bonding Bump Formation Inner Lead Bonding Testing Outer Lead Bonding Rework Tape Automated Bonding Summary Flip Chip Bump Formation Assembly Reliability Rework Flip Chip Summary Assembly Summary inces Chapter 9. Module-to-Board Connections Introduction Off-the-Shelf Connector Approach Customized Connector Approach Requirements Electrical Requirements Thermal Capabilities Mechanical Compatibility I/O Requirements MCM Connection System Reliability Attachment Approaches Peripheral I/O Connections Array Connections Survey of MCM Attachment Options Pins Solder Joints at the MCM-PCB Interface Compliant Springs at the MCM-PCB Interface Conductive Adhesives FlexCircuits Trends and Future Requirements 9.20 References 9.21

7 XÜ MULTICHIP MODULE TECHNOLOGY HANDBOOK Chapter 10. MCM Design Introduction Chapter Purpose Reasons for a Design Infrastructure MCM CAD Process Design Conception Startingthe Design Phase Library Generation Design Capture Netlist Generation Prelayout Design Evaluation Physical Design Backannotation Manufacturing Data OPostlayout Analysis MCM Test Strategy Summary Acknowledgment Suggested Readings Chapter 11. MCM Eiectrical Performance Analysis Introduction Basic Building Blocks of Eiectrical Interconnections Transmission Lines I/O Buffers Role of Physical Scale and Structure in Transmission Lines Transmission Line Properties When Is Controlled Impedance Important? Materials Properties and Transmission Lines Metal Resistivity and Permeability Resistance and Skin Effects Dielectric Constant Estimating Delays Time-Constant Estimates for Point-to-Point Interconnections Time-Constant Estimates for Bus Interconnections Delay Simulations and Examples A System Design Perspective on Delays Delay vs. Interconnection Length System Size and Delay Budget Conclusions References Chapter 12. Electronic Packaging for High-Performance Digital ICs Introduction MCMs Operating in Support of High Clock Rate Digital ICs MCMs and High-Speed IC Design Review of the Different MCM Types MCM-Ls 12.10

8 CONTENTS XIII MCM-Cs MCM-Ds Chips-First MCMs Chip-On-Board MCM Features Required for High Clock Rate Digital Systems Transmission Line Effect on MCM Design and Fabrication Achieving Low-Loss Interconnects on MCMs Multiple Power and Ground Planes in High Clock Rate MCMs Electrical Interconnect of Chips to the MCM Thermal Environment of High Clock Rate Digital MCMs Testing of High-Performance MCMs Test Fixtures for MCMs Passive Testing of MCMs External Testing of Active-Circuit MCMs Built-ln Self-Testof High-Performance MCMs Rework and Repair of High Clock Rate MCMs Packaging of MCMs Additional Requirements for First-Pass Functionality: Electromagnetic Modeling Tools Electromagnetic Parameter Extraction Modeling Noise Disturbances in Power and Ground Planes Simulation of Propagating Signal Wavefronts Has Your EM Modeling Tool Been Validated? The Future: Mixed-Signal Multichip Modules Acknowledgments References Appendix: A Brief Discussion of S-parameters Chapter 13. Thermal Management Introduction Thermal Performance Figures of Merit MCM Cooling Designs Air-Cooled Modules Liquid-Cooled Modules Technology Comparison Future Challenges References Chapter 14. Known-Good Die Introduction ConceptofKGD Impact of KGD on Yield Background Traditional Integrated Circuit Manufacturing Flow Bare Die Supplier Concerns Defect Activation Reliability Prestress Electrical Pretest 14.11

9 XIV MULTICHIP MODULE TECHNOLOGY HANDBOOK 14.3 Recent Progress on KGD Industry and Government KGD Initiatives, Evolution, and Accomplishments Standards for Unpackaged Chips Die Information Exchange Format Known-Good Die Technologies Levels of Test and Reliability Remaining Issues KGD Availability Quantification and Measurement of KGD Level Cost, Cost, Cost Future Improvements Wafer-Level KGD Assurance Technologies Singulated Bare Die Testing Information Technology: Surfing the Internet for KGD KGD from PPM IC Processing Füll KGD Availability Conclusions Acknowledgments References Chapter15. MCM Test and Design for Test MCM Test Issues Faults and Defects in MCMs Physical Faults/Defects Fault Models Test Metrics and Economics Fault Coverage Yield Defect Level and Test Leakage Test-Related Cost Issues Test Design and Test Vector Generation Test Vectors and Automatic Test Pattern Generation Design Modeling and Simulation Fault Simulation Substrate Testing and Inspection Electrical Test Methods Mechanical Contact Probe Testers Noncontact Methods Automatic Optical Inspection MCM Assembly Testing MCM Interconnect Testing In-Circuit Test Approaches ASIC Approaches to MCM Assembly Testing Design for Testability Ad-Hoc Methods MCM-Level Boundary Scan Internal Scan Design Built-In Self-Test References Index 1.1