Function. Mod. ifi 13- Sep -20

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1 Old Content - visit altium.com/documentation Mod ifi ed by on 13- Sep This reference provides technical information on configuring and using the IPC Compliant Footprints Batch Generator to generate IPC compliant footprints in a PCB library document. Building IPC compliant footprints from datasheet package information files quickly and easily is made possible by the use of the IPC Compliant Footprints Batch Generator. The generator reads the datasheet package information (dimensional data of electronic components) from Excel spreadsheets or comma delimited files and then applies the IPC equations to build IPC compliant footprints. Blank templates for package type files are provided in the Templates folder of your Altium Designer installation. These templates can be used as a starting point to enter component dimensional data. The spreadsheet is then fed into the generator to build IPC compliant footprints in PCB libraries. The following sections of this reference detail the dimensional data of each component package type for the Altium Designer's IPC Compliant Footprints Batch Generator. BGA BQFP Chip CFP CQFP DPAK LCC MELF Diode/Resistor Molded Capacitor/Diode/Inductor PQFP QFN QFN-2ROW SOIC SOJ PLCC SOP SOT23 SOT89 SOT143/343 SOT223 WireWound Function

2 Figure 1. The IPC Compliant Footprints Batch generator dialog. The IPC Compliant Footprints Batch generator allows you to generate footprint package kinds in PCB library files (*.PCBLIB) from input files, which can be Excel workbooks or comma delimited files. Such files must contain formatted component dimensional data. You can use the blank template files from the Template folder as the starting point. You then generate batches of footprints according to their footprint name (package kind) in the table. Content and Use Make a copy of the required blank template files and fill in the fields for each package that need to have corresponding footprints generated. Details of the dimensional information are mandatory and which is optional, as well as references to the dimensions they represent on the package are outlined in the respective footprint sections below. Then you can select the Tools»IPC Compliant Footprints Batch generator menu item in the PCB Library editor to launch the generator. Once the generator dialog is displayed, you can then add input package type files by clicking the Add Files button to select package input files, or drag and drop the files directly onto the dialog. Set the output folder to a suitable location. You also have the option of generating all footprints in a footprint library, a single PCB library document per input file, or an individual PCB library per footprint name. The Generate single PcbLib files per input file option will generate a PcbLib in the output folder with the same name as the input file being processed, and the footprints from this file will be put into the Pcblib. The Generate single PcbLib files per footprint name option will generate a PcbLib in the output folder for every package in the input files; either from the package field, or using the generated IPC naming convention name if

3 the field is blank. Click the Start button to process the input files and then the PcbLib files and footprints generated. To stop and close the batch process, click the Stop button or the Close button. If the Generate report on completion option is selected, then a report in HTML format will be generated and displayed containing the processed files, and any errors or warnings generated. IPC Compliant Footprint Batch Generator Component Types BGA BQFP Chip CFP CQFP DPAK LCC MELF Diode/Resistor Molded Capacitor/Diode/Inductor PLCC PQFP QFN QFN-2ROW SOIC SOJ SOP SOT23 SOT89 SOT143/343 SOT223 WireWound Package Dimensional Data and Type Summary Component package data is illustrated by its physical image, its dimensional image and a table outlining the package's dimensional data such as its name, its format type and its function in tables as described in each package below. Component package data are in metric (mm) measurement units only and is stored in an Excel file or a CSV text file and such files should contain data related to the specific package type only. Blank templates for package type files are provided in the Templates folder of your Altium Designer installation. These templates can be used as a starting point to enter component dimensional data. The first two lines in a package data template file correspond to the specific component package kind. For example, the BQFP (Bumpered Quad Flat Pack).xls file represents the BQFP package type. See an example of the BQFP data below. BQFP FootprintDescription D1min D1max Dmin Dmax Lmin Lmax Pitch Amax A1min BQFPS-44M BQFPS-44M BQFPS-68M BQFPS-84M Heel, Side and Toe Fillets Information Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side. Note, that the fillet fields are optional for defining a package's dimensional data. If all the fillet fields are defined, then the generator will try and use these fields. However if there are one or more fields, but not all fillet fields are missing, or any of the fillet fields have invalid values in them, then the automatically calculated solder fillet values will be used instead. The following packages have such fillets; BQFP, Chip, CFP, CQFP, DPAK, LCC, MELF, Molded Capacitor/Diode/Inductor, PLCC, PQFP, QFN,

4 QFN-2ROW, SOIC, SOJ, SOP, SOT23, SOT89, SOT143/343, SOT223 and Wirewound packages. Land Pattern Information Density Level A: Maximum (Most) Land Protrusion - For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull-wing devices. The geometry representing these devices, and inward and ''J''-formed lead contact device families, may provide a wider process window for reflow solder processes. Density Level B: Median (Nominal) Land Protrusion - Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow soldering of leadless chip and leaded gull-wing type devices. Density Level C: Minimum (Least) Land Protrusion - High component density typical of portable and hand-held product applications may consider the 'minimum' land pattern geometry variation. Selection of the minimum land pattern geometry may not be suitable for all product use categories. The use of classes of performance (1, 2, and 3) is combined with that of component density levels (A, B, and C) in explaining the condition of an electronic assembly. As an example, combining the description as Levels 1A or 3B or 2C, would indicate the different combinations of performance and component density to aid in understanding the environment and the manufacturing requirements of a particular assembly. For example, for those packages that have density level fields in package sections below, a typical table entry would look like this; DensityLevel Yes L, M, N M = Most Use Environment (Level A - Low Density), N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density). BGA - Ball Grid Array Name Req' d Format Description FootprintDescription If blank, then auto-generated IPC naming will be If blank, then description is auto-generated. Dmin, Dmax Yes Real Minimum and maximum Body Length ranges in mm.

5 D1ave Yes Real Nominal Row Grid length of the package in mm. Emin, Emax Yes Real Minimum and maximum Body Width Ranges in mm. E1ave Yes Real Nominal column grid width of the package in mm. A1min Yes Real Minimum Standoff Height. Amax Yes Real Maximum Height. Bnom Yes Real Nominal ball diameter. Pitch Yes Real The pitch between any two pins in mm. GridType Yes P, S P = Plain Grid or S = Staggered Grid MatrixType Yes F, P, SD, TE F = Full Matrix, P = Perimeter, SD =.Selectively Depopulated, TE = Thermally Enhanced. Rows Yes Integer Number of rows for the grid. Columns Yes Integer Number of columns for the grid. Nm Yes Integer Maximum number of balls for this BGA package. Np Yes Integer The Np field is the actual number of balls available for this BGA package especially when the BGA is depopulated. It is not uncommon to have BGA packages with ball gaps. Np is always equal or less than Nm. BQFP - Bumpered Quad Flat Pack Name Req' d Format Description FootprintDescription If blank, then description is auto-generated.

6 D1min, D1max Yes Real Minimum and maximum body length ranges in mm. Dmin, Dmax Yes Real Minimum and maximum lead span ranges in mm. Lmin, Lmax Yes Real Minimum and maximum lead length range in mm. Pitch Yes Real Distance between any two leads in mm. Amax Yes Real Maximum height in mm. A1min Yes Real Minimum standoff height in mm. Bmin, Bmax Yes Real Minimum and maximum Lead Width range in mm. Nref Yes Integer Number of leads for this package. Pin1 Yes S,C S = Corner of Left Side or C = Center of Top Side. M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment. JHmin Optional Real Minimum value for the heel fillet. JSmin Optional Real Minimum value for the side fillet. JTmin Optional Real Minimum value for the toe fillet. CFP - Ceramic Dual Flat Pack - Trimmed and Formed Gullwing Leads

7 Name Req' d Format Description FootprintDescription If blank, then description is auto-generated. Dmax Yes Real Minimum and maximum body length in mm. E1max Yes Real Minimum and maximum body width in mm. A Yes Real Maximum height in mm. A1 Yes Real Minimum stand off height in mm. BMin, BMax Yes Real Minimum and maximum lead width ranges in mm. Pitch Yes Real The distance between the centres of two pins of the package in mm. Dfmin, Dfmax Yes Real Minimum and maximum lead span ranges in mm. Lfmin, Lfmax Yes Real Minimum and maximum lead length ranges in mm. PinCount Yes Integer Number of pins for this package. M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment. JTmin Optional Real Minimum value for the heel fillet. JHmin Optional Real Minimum value for the side fillet. JSmin Optional Real Minimum value for the toe fillet. Chip - Capacitor / Inductor / Resistor

8 Name Req' d Format Description FootprintDescription If blank, then description is auto-generated. Lmin, Lmax Yes Real Minimum and maximum Body Length Ranges in mm. Wmin, Wmax Yes Real Minimum and maximum Width Length Ranges in mm. Tmin, Tmax Yes Real Minimum and maximum Bandwidth Ranges in mm. Amax Yes Real Maximum height in mm. PackageType Yes C,I,R PositivePin Yes Blank, 1, 2 C = Chip Capacitor, I = Chip Inductor or R = Chip Resistor. If the chip is an Inductor or Capacitor or then need to specify Positive Pin and these types have only two pins. Blank = None, 1 = Pin 1 or 1 = Pin 2. M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment. JTmin Optional Real Minimum value for the heel fillet. JHmin Optional Real Minimum value for the side fillet. JSmin Optional Real Minimum value for the toe fillet.

9 CQFP - Ceramic Quad Flat Pack with Trimmed and Formed Gullwing Leads Name Req' d Format Description FootprintDescription If blank, then description is auto-generated. D1min, D1max Yes Real Minimum and maximum body ranges in mm. Pitch Yes Real Distance between any two leads of this package. Amax Yes Real Maximum height of package in mm. A1min Yes Real Minimum standoff height in mm. Bmin, Bmax Yes Real Minimum and maximum lead width ranges in mm. PinCount Yes Integer Number of leads for this component package. Pin1 Yes C, S C = Centre of top side or S = Corner of Left Side of the package. M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment.

10 JHmin Optional Real Minimum value for the heel fillet. JSmin Optional Real Minimum value for the side fillet. JTmin Optional Real Minimum value for the toe fillet. DPAK - Transistor Outline Name Req' d Format Description FootprintDescription If blank, then description is auto-generated. Hmin, HMax Yes Real Minimum and maximum Length ranges in mm. B1min, B1max Yes Real Minimum and maximum lead width range in mm. Dmax Yes Real Maximum body length in mm. L2min, L2max Yes Real Minimum and maximum tab length ranges in mm. Emax Yes Real Maximum body width in mm.

11 L1min, L1max Yes Real Minimum and maximum lead length ranges in mm. L3min Yes Real Minimum tab overhang in mm. B2min, B2max Yes Real Minimum and maximum tab width ranges in mm. Amax Yes Real Maximum height of package in mm. A1min Yes Real Minimum Standoff height in mm. PinCount Yes Integer The number of pins for this package. TabNumber Yes String The name for the tab. TrimmedPins Yes String Pitch Yes Real Comma text string with pin names that are to be trimmed. Eg 1,2,3. The distance between a pin and the short pin of the DPAK package. M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment. JH1min, J2min Optional Real Minimum values for the first and second heel fillets. JS1min, JS2min Optional Real Minimum values for the first and second side fillets. JTmin Optional Real Minimum value for the toe fillet. LCC - Leadless Chip Carrier

12 Name Req' d Format Description FootprintDescription If blank, then description is auto-generated. Emin, Emax Yes Real Minimum and maximum body width ranges in mm. Dmin, Dmax Yes Real Minimum and maximum body length ranges in mm. Bmin, Bmax Yes Real Minimum and maximum pin width ranges in mm. Lmin, Lmax Yes Real Minimum and maximum pin length ranges in mm. L1min, L1max Yes Real Minimum and maximum length ranges of pin 1 in mm. Amax Yes Real Maximum height of the package in mm. A2max Yes Real Maximum package height in mm (less than Amax). NEref Yes Integer Number of pins on side of E. NDref Yes Integer Number of pins on side of D. Pitch Yes Real Distance between any two pins in mm. Pin1 Yes S2, C1 S2 = Side of D or C1 = Center of E. M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment. JHmin Optional Real Minimum value for the heel fillet. JSmin Optional Real Minimum value for the side fillet. JTmin Optional Real Minimum value for the toe fillet. MELF Component - Diode / Resistor

13 Name Req' d Format Description FootprintDescription If blank, then description is auto-generated. Lmin, Lmax Yes Real Minimum and maximum body length ranges in mm. Wmin, Wmax Yes Real Minimum and maximum body width ranges in mm. Tmin, Tmax Yes Real Minimum and maximum bandwidth ranges of pin 1 in mm. Cathode Yes 1,2 Required for MELF diodes only. Specify pin 1 or 2 for cathode. M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment. JHmin Optional Real Minimum value for the heel fillet. JSmin Optional Real Minimum value for the side fillet. JTmin Optional Real Minimum value for the toe fillet. Molded Component - Inductor / Capacitor / Diode

14 Name Req' d Format Description FootprintDescription If blank, then description is auto-generated. Lmin, Lmax Yes Real Minimum and maximum body length ranges in mm. Wmin, Wmax Yes Real Minimum and maximum body width ranges in mm. Tmin, Tmax Yes Real Minimum and maximum lead length ranges in mm. TwMin,TwMax Yes Real Minimum and maximum lead width ranges in mm. Amax Yes Real Maximum height of the package in mm. Cathode Yes 1,2 PositivePin Yes 0,1,2 Required for Molded diodes only. Specify pin 1 or 2 for cathode. Required for molded inductor/capacitors only. Specify 0 for none, pin 1 or pin 2. M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment. JHmin Optional Real JSmin Optional Real Minimum value for the heel fillet. Minimum value for the side fillet.

15 JTmin Optional Real Minimum value for the toe fillet. PLCC - Plastic Leaded Chip Carrier Square with J Leads Name Required Format Description FootprintDescription If blank, then description is auto-generated. Amax Yes Real The maximum height of the package in mm. A1min Yes Real The minimum stand off height of the package in mm. Bmin, Bmax Yes Real The minimum and maximum lead width ranges in mm. Dmin, Dmax Yes Real The minimum and maximum lead span ranges in mm. D1min. D1max Yes Real The minimum and maximum lead span ranges in mm. Pitch Yes Real The distance between two leads of the package in mm. Lmin, Lmax Yes Real The minimum and maximum lead length ranges in mm. Nref Yes Integer The number of pins for this package. Pin1 Yes S,C S = Corner of left side, C = Center of Top Side. M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment.

16 JHmin Optional Real Minimum value for the heel fillet. JSmin Optional Real Minimum value for the side fillet. JTmin Optional Real Minimum value for the toe fillet. PQFP - Plastic Quad Flat Pack Name Req' d Format Description FootprintDescription If blank, then description is auto-generated. Dmin, Dmax Yes Real Minimum and maximum lead span ranges in mm. Emin, Emax Yes Real Minimum and maximum lead span ranges in mm. Emax Yes Real Maximum lead span range in mm. D1min, D1max Yes Real Minimum and maximum lead length ranges in mm.

17 E1min, E1max Yes Real Minimum and maximum lead width ranges in mm. Bmin, Bmax Yes Real Minimum and maximum lead width ranges in mm. Lmin, Lmax Yes Real Minimum and maximum lead length ranges in mm. Pitch Yes Real Distance between any two leads in mm. Amax Yes Real Maximum Height of the package in mm. A1min Yes Real Minimum Standoff Height in mm. NDref, NEref Yes Integer NDref = number of pins for D side and NEref = no of pins for E side. Pin1 Yes S2, C1 S2 = Side of D or C1 = Center of E. ThermalPadExists D2min, D2max E2min, E2max Yes True, False Optional Real If this field contains a True then D2/E2 fields are required to define thermal pad, but if blank/false then D2/E2 fields are not required. Specify the minimum and maximum thermal pad ranges on D2 and E2 sides in mm only if the ThermalPadExists field is True. M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment. JHmin Optional Real Minimum value for the heel fillet. JSmin Optional Real Minimum value for the side fillet. JTmin Optional Real Minimum value for the toe fillet. QFN - Quad Flat Pack No Lead Type

18 Name Req' d Format Description FootprintDescription If blank, then description is auto-generated. Dmin, Dmax Yes Real Minimum and maximum body span ranges in mm. Emin, Emax Yes Real Minimum and maximum body span ranges in mm. Bmin, Bmax Yes Real The minimum and maximum lead width ranges in mm. Lmin, Lmax Yes Real The minimum and maximum lead length ranges in mm. Amax Yes Real The maximum height of the package in mm. A1min Yes Real The minimum standoff height in mm. A3min, A3max Yes Real The minimum and maximum lead heights in mm. NDref Yes Integer Number of pins on E side of the package. NEref Yes Integer Number of pins on D side of the package. Pitch Yes Real The distance between two pins of the package in mm. Pin1 Yes S2, C1 S2= Side of D or C1= Center of E. ThermalPadExists D2min, D2max E2min, E2Max PowerBarsExist Yes True, False Optional Real Optional Real Yes True, False If this field contains a True then D2/E2 fields are required to define thermal pad. If this field is blank/false then D2/E2 fields are not required. Specify the minimum and maximum thermal pad ranges on D2 side in mm only if the ThermalPadExists field is True. Specify the minimum and maximum thermal pad range on E2 side in mm only if the ThermalPadExists is True. True if power bars exist, otherwise false. M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment. JHmin Optional Real Minimum value for the heel fillet. JSmin Optional Real Minimum value for the side fillet.

19 JTmin Optional Real Minimum value for the toe fillet. QFN-2ROW - Quad Flat Pack No Lead, 2 Rows, Square Type Name Req' d Format Description FootprintDescription If blank, then description is auto-generated. Dmin, Dmax Yes Real Minimum and maximum body span ranges in mm. Emin, Emax Yes Real Minimum and maximum body span ranges in mm. Bmin, Bmax Yes Real The minimum and maximum lead width ranges in mm. Lmin, Lmax Yes Real The minimum and maximum lead length ranges in mm. Amax Yes Real The maximum height of the package in mm. A1min Yes Real The minimum standoff height in mm. Pitch1 Yes Real Pitch Yes Real ThermalPadExists D2min, D2max Yes True, False Optional Real The distance between two pins on the outer row of the package in mm. The distance between two inner pins on the inner row of the package in mm. If this field contains a True then D2 fields are required to define thermal pad. If this field is blank/false then D2 fields are not required. Specify the minimum and maximum thermal pad ranges on D2 side in mm units only if the ThermalPadExists field is True. PinCount Yes Integer The total number of pins for this package. CalculateNrefs Yes True, False If True, then ND_OuterRow, ND-InnerRow, NE- OuterRow and NE-InnerRow fields need to be defined. If False, then these fields are not to be defined. ND-OuterRow Optional Integer The number of pins on the outer ND side.

20 NE-OuterRow Optional Integer The number of pins on the outer NE side. ND-InnerRow Optional Integer The number of pins on the inner ND side. NE-InnerRow Optional Integer The number of pins on the inner NE side. M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment. JHmin Optional Real Minimum value for the heel fillet. JSmin Optional Real Minimum value for the side fillet. JTmin Optional Real Minimum value for the toe fillet. SOIC - Small Outline Integrated Package with 1.27mm Pitch - Gullwing Leads Name Req' d Format Description FootprintDescription If blank, then description is auto-generated. Hmin, Hmax Yes Real Minimum and maximum width ranges in mm.

21 Smin, Smax No Real Minimum and maximum heel spacings in mm. By default, the heel spacing is calculated by subtracting twice the maximum Lead length Range from the Minimum Body Width Range. Bmin, Bmax Yes Real Minimum and maximum lead width ranges in mm. Lmin, Lmax Yes Real Minimum and maximum lead length ranges in mm. Emin, Emax Yes Real Minimum and maximum body widths in mm. Dmin, Dmax Yes Real Minimum and maximum body lengths in mm. Amax Yes Real Minimum height in mm. A1min Yes Real Minimum standoff height in mm. PinCount Yes Integer Number of pins for this SOIC package. AbsentPins Yes String ThermalPadExists Yes True, False D2min, D2max No Real E2min, E2max No Real If blank no pins are absent. Otherwise a sequence of pin numbers separated by a comma that are required to be absent from the package for example 1,2,5. If this field contains a True then D2/E2 fields are required to define thermal pad. If this field is blank/false then D2/E2 fields are not required. Specify the minimum and maximum thermal pad ranges on D2 side in mm only if the ThermalPadExists field is True. Specify the minimum and maximum thermal pad ranges on E2 side in mm only if the ThermalPadExists is True. M = Most Use Environment (Level A - Low Density), N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density). JHmin Optional Real Minimum value for the heel fillet. JSmin Optional Real Minimum value for the side fillet. JTmin Optional Real Minimum value for the toe fillet.

22 SOJ - Small Outline Package with J Leads Name Req' d Format Description FootprintDescription If blank, then description is auto-generated. Emin,Emax Yes Real Minimum and maximum width ranges in mm. Bmin, Bmax Yes Real Minimum and maximum lead width ranges in mm. Lmin, Lmax Yes Real Minimum and maximum lead length range in mm. E1max Yes Real Maximum body width in mm. Dmax Yes Real Maximum body length in mm. Amax Yes Real Maximum height of the package in mm. A1min Yes Real Minimum standoff height in mm. PinCount Yes Integer Number of pads for the package. AbsentPins Yes String Pitch Yes Real If blank no pins are absent. Otherwise a sequence of pin numbers separated by a comma that are required to be absent from the package for example 1,2,5. The pitch (e) is the distance between any two pins of the package in mm. M = Most Use Environment (Level A - Low Density), N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density).

23 JHmin Optional Real Minimum value for the heel fillet. JSmin Optional Real Minimum value for the side fillet. JTmin Optional Real Minimum value for the toe fillet. SOP - Small Outline Package with Gullwing Leads Name Req ' d Format Description FootprintDescription If blank, then description is auto-generated. Hmin, Hmax Yes Real The minimum width range in mm. Bmin, Bmax Yes Real Lmin, Lmax Yes Real Minimum and maximum lead (pin) width ranges in mm. Minimum and maximum lead (pin) length ranges in mm. Emax Yes Real Maximum body width of the package in mm. Dmax Yes Real Maximum body length of the package in mm. Amax Yes Real Maximum height of the package in mm. A1min Yes Real Minimum standoff height in mm. PinCount Yes Integer The number of pins for this package.

24 AbsentPins Yes String Pitch Yes Real ThermalPadExists D2min, D2max E2min,E2max Yes True, False Optional Real Optional Real A sequence of pin numbers separated by a comma that are required to be absent from the package for example 1,2,5. If blank no pins are absent. The distance between two pins (leads) on this package. If this field is True then D2/E2 fields are required to define thermal pad. If blank/false then D2/E2 fields are not required. Specify the minimum and maximum thermal pad ranges on D2 side in mm only if the ThermalPadExists field is True. Specify the minimum and maximum thermal pad ranges on E2 side in mm only if the ThermalPadExists is True. M = Most Use Environment (Level A - Low Density), N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density). JHmin Optional Real Minimum value for the heel fillet. JSmin Optional Real Minimum value for the side fillet. JTmin Optional Real Minimum value for the toe fillet. SOT23 - Small Outline Transistor

25 Name Req' d Format Description FootprintDescription If blank, then description is auto-generated. Emin, Emax Yes Real The minimum and maximum lead span ranges in mm. Bmin, Bmax Yes Real The minimum and maximum width ranges in mm. Lmin, Lmax Yes Real The minimum and maximum lead length ranges in mm. E1min, E1max Yes Real Dmin, Dmax Yes Real The minimum and maximum body width ranges of the package in mm. The minimum and maximum body length range of the package in mm. Amax Yes Real The maximum height of the package in mm. A1min Yes Real The minimum standoff height of the package in mm. PinCount Yes Integer The number of leads (pins) for this package. PinOrder Yes String Pitch Yes Real Pitch1 Yes Real Comma separated string specifies pin ordering. Eg 1,2,3 for 3 pin version. 5 or 6 lead versions have this field blank as it is assumed to be 1,2,3,4,5 or 1,2,3,4,5,6. The distance between the unary pin on the opposite side and a pin on the other side in mm. The distance between two pins on the same side in mm. M = Most Use Environment (, N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density). JHmin Optional Real Minimum value for the heel fillet. JSmin Optional Real Minimum value for the side fillet. JTmin Optional Real Minimum value for the toe fillet. SOT89 - Small Outline Transistor

26 Name Req'd Format Description FootprintDescription PackageType Yes 143, 343 Emin, Emax Yes Real If blank, then description is auto-generated. 143 corresponds to SOT143 and 343 corresponds to SOT343. The minimum and maximum body width ranges of the package in mm. Dmin, Dmax Yes Real The minimum and maximum body length ranges in mm. Amax Yes Real The maximum height of the package in mm. ReversePins Yes Boolean If Pins need to be reversed, Set to TRUE. Otherwise leave field blank. Hmin, Hmax Yes Real The minimum and maximum lead span ranges in mm. Bmin, Bmax Yes Real The minimum and maximum lead width ranges in mm. B1min, B1max Yes Real The minimum and maximum center lead width ranges in mm. D1min, D1max Yes Real The minimum and maximum tab width range in mm. Lmin, Lmax Yes Real The minimum and maximum lead length range of the package in mm. H1min, H1max Yes Real The minimum and maximum tab length ranges in mm. Pitch Yes Real Distance between two thin leads. M = Most Use Enviro, N = Nominal Use Enviro, L = Least Use Enviro.

27 JHmin JS1min, JS2min, JS3min JTmin Optional Real Minimum value for the heel fillet. Optional Real Minimum value for the side fillet. Optional Real Minimum value for the toe fillet. SOT143/343 - Small Outline Transistor Name Req' d Format Description FootprintDescription PackageType Yes 143, 343 Emin, Emax Yes Real Bmin, Bmax Yes Real B2min, B2max Yes Real If blank, then description is auto-generated. The value 143 corresponds to SOT143 and this 343 corresponds to SOT343. The minimum and maximum lead span ranges of the package in mm. The minimum and maximum thin lead width ranges in mm. The minimum and maximum thick lead width ranges in mm. E1min, E1max Yes Real The minimum and maximum body width ranges in mm. Dmin, Dmax Yes Real The minimum and maximum body length ranges in mm. Lmin, Lmax Yes Real The minimum and maximum lead length range of the package in mm.

28 Amax Yes Real The maximum height of the package in mm. A1min Yes Real The minimum stand off height in mm. PinOrder Yes String Comma separated string which denotes the order of pins. Eg 1,2,3. Pitch Yes Real Distance between two thin leads. Pitch1 (e1) Yes Real PitchOffset Yes Real CalculatePitch1 Yes String LargePinCount Yes Integer LargePinLocation Yes String Distance between thick n thin leads on the same side. Distance between thick n thin leads on opposite sides. If True, then the PitchOffset is used to calculate Pitch1. If blank, Pitch1 only. LargePinCount is 1 or 2. If LargePinCount = 2, top left/top right pins set large. LargePinLocation (when LargePinCount = 1) is TL, BL, BR or TR for 'Top left','bottom left', 'Bottom right', and 'Top right' respectively. M = Most Use Enviro, N = Nominal Use Enviro, L = Least Use Enviro. JHmin Optional Real Minimum value for the heel fillet. JSmin Optional Real Minimum value for the side fillet. JTmin Optional Real Minimum value for the toe fillet. SOT223 - Small Outline Transistor

29 Name Req'd Format Description FootprintDescription If blank, then description is auto-generated. Emin, Emax Yes Real The minimum and maximum lead span ranges in mm. Bmin, Bmax Yes Real The minimum and maximum lead width ranges in mm. Lmin, Lmax Yes Real The minimum and maximum lead length ranges in mm. E1min, E1max Yes Real The minimum and maximum body width ranges in mm. Dmin, Dmax Yes Real The minimum and maximum body length ranges in mm. B2min, B2max Yes Real The minimum and maximum tab width ranges in mm. Amax Yes Real The maximum height of the package in mm. A1min Yes Real The minimum standoff height in mm. Nref Yes Integer The number of leads (including tab). Pitch Yes Real Pitch1 Yes Real The length between two normal adjacent leads (not the tab lead) in mm. The length between the extremes of normal leads ie the first and the last normal leads on the same side of the package in mm. M = Most Use Environment (Level A - Low Density), N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density). JHmin Optional Real Minimum value for the heel fillet. JSmin Optional Real Minimum value for the side fillet. JTmin Optional Real Minimum value for the toe fillet. Wire Wound - Precision Wire Wound Inductor, 2 Pins

30 Name Req'd Format Description FootprintDescription If blank, then description is auto-generated. Lmin, Lmax Yes Real The minimum and maximum body length ranges in mm. Wmin, Wmax Yes Real The minimum and maximum body width ranges in mm. Tmin, Tmax Yes Real The minimum and maximum lead length ranges in mm. Twmin, Twmax Yes Real The minimum and maximum lead width width ranges in mm. Amax Yes Real The maximum height of the package in mm. Positive Yes 0,1,2 The specified pin location that has the positive polarity. 0 denotes no polarity. M = Most Use Environment (Level A - Low Density), N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density). JHmin Optional Real Minimum value for the heel fillet. JSmin Optional Real Minimum value for the side fillet. JTmin Optional Real Minimum value for the toe fillet.

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