Fill the Void. Tony Lentz Greg Smith
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1 Fill the Void Tony Lentz Greg Smith
2 Outline/Agenda Introduction Factors that Influence Voiding Voiding Results What Have We Learned About Voiding? Future Work Acknowledgements Q & A
3 Introduction Do you have voids in your life?
4 Introduction Good news! We have solutions!
5 Void: (noun) Introduction 1. A completely empty space. The black void of space. 2. Gap in the solder joint where the solder does not fill the space completely. *Image from Nihon Superior, Controlling the Voiding Mechanisms in the Reflow Soldering Process, Proceedings of IPC APEX Expo 2016.
6 Introduction *IPC 7095C, Design and Assembly Process Implementation for BGAs, 2013-January.
7 Void Limits *IPC 7095C, Design and Assembly Process Implementation for BGAs, 2013-January.
8 Void Limits *IPC 7095C, Design and Assembly Process Implementation for BGAs, 2013-January.
9 Factors that Influence Voiding *Diagram from Nihon Superior, Controlling the Voiding Mechanisms in the Reflow Soldering Process, Proceedings of IPC APEX Expo 2016.
10 Factors that were Studied
11 Factors that were Studied PRINT / DISPENSE Stencil Design was Varied on QFN Thermal Pads: QFN 68 lead 10 mm body 0.5 mm pitch Tin finish
12 Factors that were Studied PRINT / DISPENSE Printed paste on QFN Thermal Pads (65% Area Covered): ENIG Surface Finish
13 Factors that were Studied REFLOW - Reflow Profile was Varied: RTS (Ramp to Spike) TAL sec Peak C Both Ramp 1.1 C/sec Length min RTS-HT (High Temperature) TAL sec Peak C
14 Factors that were Studied SOLDER PASTE Two lead-free water soluble solder pastes were used: Paste A = 88.0% SAC305 Type 3. Moderate Activity. Paste B = 88.5% SAC305 Type 3. High Activity.
15 Equipment Printer: 30 mm/sec, 1.0 lb/in, 1.5 mm/sec separation Pick and Place
16 Equipment Reflow Oven: simulates 10 zone, reflow in air X-Ray: voltage 70 kv, current 400 µa
17 Box and Whisker Plot
18 Voiding Results Solder Paste SOLDER PASTE A SOLDER PASTE B
19 Tukey-Kramer HSD Testing Data sets represented by circles 95% confidence level Connecting letters shows differences
20 Voiding Results Solder Paste SOLDER PASTE A
21 Voiding Results Stencil Design
22 Voiding Results Stencil Design 5-Dot (U11) has Higher Voiding
23 Voiding Results Reflow Profile RTS RTS-HT
24 Voiding Results Reflow Profile No Significant Difference
25 Voiding Results Stencil Design by Solder Paste SOLDER PASTE A SOLDER PASTE B
26 Voiding Results Stencil Design by Solder Paste SOLDER PASTE A SOLDER PASTE B
27 Voiding Results Reflow Profile by Solder Paste SOLDER PASTE A SOLDER PASTE B
28 Voiding Results Reflow Profile by Solder Paste SOLDER PASTE A SOLDER PASTE B
29 Void Size
30 Voiding Results Largest Void
31 Voiding Results Largest Void by Solder Paste Larger Voids with Paste B
32 Voiding Results Largest Void by Stencil Design
33 Voiding Results Largest Void by Reflow Profile Profile - No Significant Difference
34 Previews of Coming Attractions Voiding with vapor phase reflow and vacuum Using vapor phase with vacuum to rework voids
35 Vapor Phase Reflow No vacuum Main Vac during liquidus Prevac 1 before heating Prevac 2 during heating before liquidus
36 Voiding Results Vapor Phase No Vac Main Vac Main Vac Prevac 1 Main Vac Prevac 1 And 2 Solder Paste B SAC305 T3 Linear ramp profile in vapor phase
37 Voiding Results Vapor Phase Vapor phase with vacuum lowers voiding dramatically
38 Voiding Results Vapor Phase as a Rework Method Solder Paste B SAC305 T3 1 st convection reflow 2 nd vapor phase with vacuum
39 Voiding Results Vapor Phase as a Rework Method Vapor phase with vacuum can rework voids
40 What Have We Learned About Voiding? Solder paste B generated higher voiding and larger voids than solder paste A The 5-Dot stencil pattern generated higher voiding and larger voids than the other designs. The RTS profile generated higher voiding with solder paste A, while the RTS-HT profile generated higher voiding with solder paste B As total void area increases, the largest void size increases.
41 How to Fill the Void Use a solder paste that generates low voiding in your process. Optimize the stencil design to minimize voiding. Optimize the reflow profile for your solder paste to minimize voiding.
42 Future Work Voiding mitigation work is ongoing and results will be presented in future papers. Some of the variables being studied are as follows: Vapor phase reflow with vacuum Convection reflow using nitrogen No clean vs. water soluble solder pastes Particle size of the solder powder used (T3, T4, T5) Manufacturer of the solder powder Additional stencil designs are being tested
43 Acknowledgements Many thanks to McKennah Repasky, a summer intern with FCT Assembly, for all of her hard work running the testing for this paper. We appreciate the support and help of A- Tek Systems for running the Vapor phase experiments.
44 Tony Lentz
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