Potential assessment and integrative development of MID-parts

Transcription

1 Potential assessment and integrative development of MID-parts Prof. Dr.-Ing. J. Gausemeier, He einz Nixdorf Institute e, University of Pad erborn Dipl.-Wirt.-Ing. Tobias Gaukstern Prof. Dr.-Ing. Jürgen Gausemeier Dipl.-Ing. Roman Dumitrescu 9th International Congress Molded Interconnect Devices Fürth, Germany September 29th

2 Potential assessment and integrative development of MID-parts Prof. Dr.-Ing. J. Gausemeier, He einz Nixdorf Institute e, University of Pad erborn 1 Introduction 2 Potential assessment 3 Integrative development 4 Conclusion 2

3 Categories of mechatronic systems 3 Prof. Dr.-Ing. J. Gausemeier, Heinz Nixdorf Institute, University of Paderborn

4 How tapping the MID potential? For which products is MID worthwhile? How can be MID-parts successfully developed? Prof. Dr.-Ing. J. Gausemeier, He einz Nixdorf Institute e, University of Pad erborn Challenges facing during tapping the MID potential MID-parts are marked by a high complexity as a result of the integral construction Strong dependencies between the MID-product and the MID manufacturing technologies Increasing interactions and dependencies between mechanic construction and electronic design Recognizing and evaluating chances of MID systematically Interdisciplinary and integrative development of MIDs 4

5 Potential assessment and integrative development of MID-parts Prof. Dr.-Ing. J. Gausemeier, He einz Nixdorf Institute e, University of Pad erborn 1 Introduction 2 Potential assessment 3 Integrative development 4 Conclusion 5

6 Analyzing product and manufacturing process Identifying the strength and weaknesses of the existing product concept Search for potential ti improvements using predefined d search fields Search-fields forareas in which the technology MID can achieve excellent solutions Prof. Dr.-Ing. J. Gausemeier, He einz Nixdorf Institute e, University of Pad erborn Analyzing the product Number of variants Manufacturing costs Electrical requirements Mechanical requirements Analyzing the manufacturing process Process flexibility Process stability Process complexity Process diagram: cut-out of the existing manufacturing process 6

7 Identifying MID-functions and developing MID product ideas J. Gausemeier, He einz Nixdorf Institute e, University of Pad erborn Electronical MID-functions Transferirng electrical energy Assembling with neighbored groups Contacting electronic parts Conducting signals Protecting form high currents Protecting from electromagnetical fields Mechanical MID-functions Carrying parts Protecting parts Stabilizing parts Transferring force Conducting thermally energy Marking parts Prof. Dr.-Ing. 7

8 erborn J. Gausemeier, He einz Nixdorf Institute e, University of Pad Prof. Dr.-Ing. Selection of appropriate MID manufacturing technologies Comparison of requirement profile and property profile Assessing the MID-manufacturing technologies on technical features Assessing the requirements of the MID product Ideas on product features Direct allocation of requirements of the MID-product ideas to the property profiles of the MID manufacturing technologies Selection of manufacturing technologies with the greatest correlation Selection of technologies: comparison of the MID manufacturing technology two shot molding with the MIDproduct idea Process diagram: cut-out t of the manufacturing process 8

9 Potential and risk of the MID-product ideas 9 Prof. Dr.-Ing. J. Gausemeier, Heinz Nixdorf Institute, University of Pad erborn

10 Potential assessment and integrative development of MID-parts Prof. Dr.-Ing. J. Gausemeier, He einz Nixdorf Institute e, University of Pad erborn 1 Introduction 2 Potential assessment 3 Integrative development 4 Conclusion 10

11 Autonomous miniature robot BeBot Test carrier for intelligent machines and cooperative networks Main PCB: 520 MHz processor, Linux operating system, 128 MB working memory and an FPGA processor for real time image processing Prof. Dr.-Ing. J. Gausemeier, He einz Nixdorf Institute e, University of Pad erborn Base PCB: 75 MHz processor (ARM7) for drive control, sensor analysis und energy management. Sensors: 12 Infrared sensors on the housing for the 360 detection of the environment and a VGA camera Drive: 2 miniaturized electric motors with 2,8 W power each and high h efficiency i provide high h acceleration 68 mm 11

12 MID housing Miniaturization by integration of functions 12 Prof. Dr.-Ing. J. Gausemeier, Heinz Nixdorf Institute, University of Paderborn

13 Prof. Dr.-Ing. J. Gausemeier, He einz Nixdorf Institute e, University of Paderborn Depiction of the specification during the integrative conceptual design of the BeBot and its production system 13

14 Integrative development of mechanic construction and electronic design e, University of Paderborn einz Nixdorf Institute J. Gausemeier, He Prof. Dr.-Ing. Layout design: 2D ECAD circuit layout design of the BeBot in Altium Designer Circuit carrier elaboration: 3D MCAD electronic part assembly of the BeBot in CATIA V5 Mastering the gap between 2D ECAD and 3D MCAD: Transmitting components Transmitting of the SMD-components from Altium Designer to CATIA using STEP format Each partial area have to be transmitted individually and fitted together in an assembly 14

15 Integrative development of mechanic construction and electronic design Layout design in 3D MCAD: Designing circuit structure in CATIA Prof. Dr.-Ing. J. Gausemeier, He einz Nixdorf Institute e, University of Paderborn Layout design in 3D MCAD : Designing g solder pads in CATIA Mastering the gap between 2D ECAD and 3D MCAD: Transmitting circuits Drawing and minting each solder pad and circuit according to the circuit layout design Considering the restrictions by the manufacturing technologies: The accessibility of the laser device has to be granted 15

16 Potential assessment and integrative development of MID-parts Prof. Dr.-Ing. J. Gausemeier, He einz Nixdorf Institute e, University of Pad erborn 1 Introduction 2 Potential assessment 3 Integrative development 4 Conclusion 16

17 Conclusion Prof. Dr.-Ing. J. Gausemeier, He einz Nixdorf Institute e, University of Pad erborn Conclusion MIDs are based on the close interaction ti of mechanics and electrics/electronics. l t i The used MID manufacturing technologies highly determine the MID-product concept. It is necessary to identify products having MID-potential. Furthermore product and production system have to be developed in an interplay right from the beginning. The presented approach enables recognizing and evaluating the chances of MIDs. Next steps are the definition of MID-features describing product design and manufacturing integrative. The intention is the support of methodical development of MID-parts. 17

18 Thank you for your attention erborn Prof. Dr.-Ing. J. Gausemeier, He einz Nixdorf Institute e, University of Pad Heinz Nixdorf Institute University of Paderborn Product Engineering Fuerstenallee Paderborn Phone: Fax.: